Gray 94 V0 3.0W/MK CPU Thermal Pad TIF5100-30-11US 2.5mmT For High Speed Mass Storage Drives
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...CPU Thermal Pad TIF5100-30-11US 2.5mmT For High Speed Mass Storage Drives Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF500-30-11US Datasheet-REV02.pdf TIF5100-30-11US Series thermally......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Naturally tacky grey Good Thermal Conductive pad For CPU Heat Dissipation 3.0 W/mK RoHS compliant TIF500-30-11US 25 Sh
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Naturally tacky blue Good Thermal Conductive pad For CPU Heat Dissipation 3.0 W/mK RoHS compliant TIF500-30-11US 25 Shore 00 The TIF500-30-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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TIF100-30-11US Thermal Conductivity 1.5W Thickness 0.5~5.0mm Silicone Thermal Pad Insulation Thermal Pad For Game Machine
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TIF®100-30-11US Thermal Conductivity 1.5W Thickness 0.5~5.0mm Silicone Thermal Pad Insulation Thermal Pad For Game Machine Product descriptions TlF®100-30-11US Series thermally conductive interface materials are applied to fill the air gaps between the ......
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