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Подложки DBC (Direct Bonded Copper)

Подложки DBC (Direct Bonded Copper) The DBC (Direct Bond Copper) technology consists in attaching a thick copper foil with a thickness of 0.125 to 0.700 mm to a ceramic substrate based on aluminum oxide or nitride. High adhesion rates are provided due to ......

HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

Address: No. 26, Dongqing Street, High-tech Zone, Zhengzhou ,Henan, China

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