Two Component Epoxy Potting Compound Resin Thermal Conductive Clear Black Liquid
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HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5......
Shenzhen Hanast New Material co.,LTD
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Electrical Insulation Epoxy Potting Compound , 24 Hours Transparent Casting Resin
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Wholesale APG molds with electrical insulation epoxy resin for EMBEDDED POLES Product TDS: JT 8259A Epoxy Resin 100 pbw JT 8259B Epoxy Hardener 80 pbw Wholesale APG molds with electrical insulation epoxy resin can be a useful material for embedded poles......
JIANGTE INSULATION COMPOSITE
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Medium Temperature Curing Epoxy Potting Compound For Electrical Components
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...Epoxy Potting Compound For Electrical and Electronical Components 1. DESCRIPTION SEP595-F is a two-component, medium-temperature curing, epoxy potting compound. This product is environmentally friendly, does not contain toxic and harmful substances, has low viscosity, good fluidity, and is easy to flow into the gap. After curing, it has good insulation performance. Sealing for electrical and electronical components......
GUANGZHOU BAIYUN TECHNOLOGY CO., LTD.
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6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound
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...HT6202T) double component heat curing epoxy potting adhesive is for Automobile ignition coil potting 202 (HT6202T) double component heat curing epoxy potting adhesive is two components, heating curing, translucent, automobile ignition coil epoxy adhesive. ......
Shanghai Huitian New Material Co., Ltd
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Hall Sensor Epoxy Potting Compound Glue Potting Machine Meter Mix Dosing Dispenser
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... of two component resins (epoxy, polyurethane, silicone..) in the atmospheric environment. Machine Picture Machine Working principle Compound materials A & B are kept in two tanks separately. There are two sets of metering pumps inside the machine for...
Kapudun Automation Equipment (Guangzhou)CO.,ltd
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Silicone Rubber Epoxy Potting Compounds Pouring Sealant For Potting Electronic
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...Potting Compounds Pouring Sealant For Potting Electronic Quick Detail: Name Epoxy Resin 1477 Usage Construction, Fiber & Garment, Footwear & Leather, LED Mixing Ratio A: B =1:1 (By weight) Applications Epoxy floor coatings,Electronic component potting epoxy compound Description: silicone systems. Our products show excellent electrical......
Chongqing Aorun Industrial Co., Ltd.
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16.5*17.5mm Common Mode Toroidal Chokes Low Profile Epoxy Potting Compound
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STC07 Series surface mount toroidal coils and common mode toroidal choke,SMD Common mode inductor,pad size 16.5*17.5mm FEATURES: · Inductance: 1mH to 39mH · Rated current: 0.3A to 2A · Higher Frequency · High Saturation Material · Low EMI Radiation · Pick......
Shaanxi Shinhom Enterprise Co.,Ltd
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Indoor electrical insulator potting compound two component epoxy resin liquid
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...-viscosity solvent-free modified polyol. Indoor electrical insulator potting compound two component epoxy resin liquid Applications Indoor electrical insulators for medium and high voltage applications, such as insulators, dry-type transformers, and other...
Shanghai Wenyou Industry Co., Ltd.
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TIE280-15AB Two-Component Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound For Circuit Board
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...Component Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound For Circuit Board Product Summary: TIE™ 280-15AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Two-component solventless room temperature curing epoxy potting-sealing material Compound
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We Supply Free Samples. OEM & ODM are Welcomed. we can do your logo and Brand Two-component solventless room temperature curing epoxy potting-sealing material Compound Specification TESTING ITEM ESTING STANDARD VALUE of Ep3102 ---- ---- PART A PART B ......
Shanghai Max Tech Co.,Ltd
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