Various Electronic Device CPU Thermal Pad TIF540-30-11US Grey High Performance
|
...CPU thermal pad TIF540-30-11US with grey color for various electronic device Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF500-30-11US Datasheet-REV02.pdf TIF540-30-11US Series thermally......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
Thermal Conductivity 8.0W/m-K Heat Sink Thermal Pad for Electronic Devices CPU PC GPU
|
Wholesale High Perfomance Heat Sink Thermal Pad for For Electronic Devices Ziitek TIF7100Q is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
TIF700PUS Custom 7.5W/Mk 3Mm 2Mm 1.5Mm Silicone Conductive Soft Gpu Cpu Thermal Pad
|
TIF700PUS Custom 7.5W/Mk 3Mm 2Mm 1.5Mm Silicone Conductive Soft Gpu Cpu Thermal Pad Product descriptions TIF®700PUS Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
|
...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal...
Shenzhen Aochuan Technology Co., Ltd
|
High Volume Resistivity Custom CPU Thermal Pad with Options Density 3.0±0.5 G/cm3
|
Product Description: With an operating temperature range of -40°C to 200°C, this Silicone Thermal Pad can easily handle extreme temperatures, making it a perfect choice for use in high-temperature applications. Its continuous use temperature range of -40......
Shenzhen Antac Technology Limited
|
Electronic Devices 26℃ Thermal Management Phase Change Material - Chip Cooling Companion
|
Electronic Devices 26℃ Thermal Management Phase Change Material - Chip Cooling Companion Highlights of the product: 1. Effective thermal management: When the phase transition occurs at about 26 ° C, a large amount of heat can be absorbed or released. When......
Sichuan Aishipaier New Material Technology Co., Ltd.
|
Coated Paper Hang Tab Box Packaging For Silicone CPU Thermal Pads SIM CARD
|
#detail_decorate_root .magic-0{border-bottom-style:solid;border-bottom-color:#53647a;font-family:Roboto;font-size:24px;color:#53647a;font-style:normal;border-bottom-width:2px;padding-top:8px;padding-bottom:4px}#detail_decorate_root .magic-1{width:750px;......
Shenzhen Senwi Printing & Packaging Co., Ltd.
|
Insulation Heat Sink CPU Thermal Grease For Electron Component
|
...CPU Thermal Grease for Electron Component Discription of CPU Silicone Grease : CPU Thermal grease is a material used to fill the gap between the CPU and the heatsink, which is also called thermal interface material. Its role is to conduct the heat emitted by the CPU to the heatsink, so that the CPU temperature is maintained at a stable working level, preventing the CPU......
Trumony Aluminum Limited
|
Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
|
... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and...
SZ PUFENG PACKING MATERIAL LIMITED
|
3W/MK Soft Silicone Thermal Pad Insulating Sheet for Computer CPU GPU Chip Heat Sink Heatsink Cooling Thermal Conductive Pad
|
...Thermal Conductive Silicone Pad is made of silicone, a durable material that can withstand high temperatures and harsh environmental conditions. With a hardness of 45 ShoreC and a tensile strength of 3 MPa, this Thermal Heat Sink Pad can provide excellent mechanical support and protect your electronic components from damage. Designed to operate in extreme temperatures, this Thermal Conductive Silicone Pad......
Shenzhen Linmao Electronic Material Co.,Ltd.
|
Submit your “electronic device cpu thermal pad” inquiry in a minute :