Fully Automatic Flip Chip Die Bonder Transistor Die Bonding Machine Semiconductor Die Bonding Machine
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... docking station with dual swing arms for 180° cross-bonding. 2. Compatible with a printer to enable a variety of in-line process solutions. 3. Fully integrated carrier from loading, printing, to die bonding and...
Shenzhen Hongxinteng Technology Co., Ltd.
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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used
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...Flip Chip Die Bonder Machine Original And Used ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder......
INFINITE AUTOMATION CO ., LIMITED
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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
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Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die......
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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Micro COB Fine Indoor 4K/8K LED Video Wall Screen Display Mature Flip-Chip Technology
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...fully flip-chip Mini LED COB full-color display independently designed and manufactured. Each pixel on the front of the display unit module of this series is fully flip-chip integrated and assembled, and each chip is fixed to the circuit board. On, connect the system to display the screen. Full die......
Shen Zhen AVOE Hi-tech Co., Ltd.
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CSP Flip Chip X Ray Inspection Equipment Semiconductor X Ray Machine For Pcb
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... or BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Fully automatic BGA detection program 1. Simple mouse click to write program. 2. Automatic analysis on diameter, proportion of cavity, area and roundness of BGA. 3. Automatic BGA detection ......
Shenzhen Wisdomshow Technology Co.,ltd
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SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon
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... (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system...
Unicomp Technology
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French Fries Banana Chips Fryer Electric Namkeen Making Machine
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... working. 3. Full of design and easy operate. 4. The capacity depend on the customer's request:small/medium/big Electric control cabinet Flip-type fryer The independent electric control cabinet is safe and...
Henan huafood machinery technology co., LTD
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Electric Kurkure Making Machine Cheetos Corn Chips Snacks Manufacturing Machine
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Fully Automatic Kurkure Cheetos Corn Chips Making Machine Plant No Pollution 1. Product Description: Fully Automatic Kurkure Cheetos Corn Chips Making Machine Plant No Pollution Kurkure/Cheetos/Nik nak are extruded snacks, very crunchy and great in taste. Kurkure are made by extrusion process. The Kurkure corn meal is moisturized in the flour mixer with water and fed to the Rotary die......
Jinan Saibainuo Technology Development Co., Ltd
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Recycled ESD Custom JEDEC Trays Die Transport BGA Chips High Temperature Resistance
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Recycled ESD Custom JEDEC Trays Transport BGA Chips High Temperature Resistance Engineered for precision and protection, our JEDEC trays are fully customizable to fit your unique chip or module dimensions. The design of the structure and shape in line wit......
Shenzhen Hiner Technology Co., Ltd.
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RGBW 15W RGB LED Array
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...Flip-chip Package LED 15W RGBW LEDs Features: Small and bright package LEDs, fully-holded patent, Compatible with Optical LENs of Cree XLamp XML Color,MCE LEDs, Osram Ostar LEDs Compact LED light source with small LES, RGBW chips evenly distributed in 2.4x2.4mm space Same light-emitting shape for the 4 color LED die......
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
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