Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators
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...Gold Bonding Wire for Precision IC & Semiconductor Packaging Our high-purity gold bonding wire is specially engineered for inner lead packaging in advanced integrated circuits (ICs) and semiconductor separators. With diameters customizable from 15μm to 50μm, it delivers exceptional electrical conductivity, thermal stability, and bond......
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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CLT-107-02-S-D-BE-A-K-TR Headers Wire Housings Integrated Circuits ICs
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CLT-107-02-S-D-BE-A-K-TR Headers Wire Housings Low Profile Dual-Wipe Socket, 2.00 mm Pitch Manufacturer: Samtec Product Category: Headers & Wire Housings Product: Sockets Type: Socket Number of Positions: 14 Position Pitch: 2 mm Number of Rows: 2 Row ......
Wisdtech Technology Co.,Limited
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Hermetic Hybrid Integrated Circuit Package
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Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness:> 0.45μm Hermeticity: leak rate ≤1x10-3Pa.cm3/s(He) Insulation ......
JOPTEC LASER CO., LTD
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Integrated Circuit Chip STG200M65F2D8AG Automotive Grade IGBT Transistors 650V
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Integrated Circuit Chip STG200M65F2D8AG Automotive Grade IGBT Transistors 650V Product Description Of STG200M65F2D8AG STG200M65F2D8AG is Automotive-grade 650V, 200A trench gate field-stop M series low-loss IGBT die in D8 packing. Specification Of STG200M65F2D8AG Part Number: STG200M65F2D8AG Size: 9.73mm X 10.23mm Die Thickness: 70μm Front Side Passivation: Silicon Nitride Front Side Metallization Thickness: 4.5μm Recommended Wire Bonding......
ShenZhen Mingjiada Electronics Co.,Ltd.
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Integrated Circuit Chip EPM3128ATC100-10N ----- Programmable Logic Device Family
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... 270 Category Integrated Circuits (ICs) Family Embedded - CPLDs (Complex Programmable Logic Devices) Series MAX® 3000A Packaging Tray Programmable Type In System ......
Mega Source Elec.Limited
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XC6SLX45-2FGG484I Integrated Circuit Chip Spartan-6 Family Overview
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Summary of Spartan-6 FPGA Features • Spartan-6 Family: • Spartan-6 LX FPGA: Logic optimized • Spartan-6 LXT FPGA: High-speed serial connectivity • Designed for low cost • Multiple efficient integrated blocks • Optimized selection of I/O standards • ......
ChongMing Group (HK) Int'l Co., Ltd
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Integrated Circuit Micro Lead Frame , Exquisite Metal Stamping Parts Progressive Die
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... from the die to the outside. Leadframe for a QFP package The die inside the package is typically glued to the lead frame, and then bond wires attach the die pads to the leads. In the last stage of the manufacturing process, the lead frame is moulded in a...
Xiamen METS Industry & Trade Co., Ltd
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4080 6080 Aluminium Extruded Sections For Arduino Integrated Circuits
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...Integrated Circuits Basic Information Name JY1-02-20 Material 6080GR Surface Treatment Electroplating, spraying, wire drawing, anode, sand blasting, passivation, polishing, oxide film treatment as customer's requestment Colour stainless steel, bronze, gold......
Jiangyin Longkang Metal Products Co., Ltd
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Digital DVI Engineering Cable With IC – High-Performance Video Cable With Integrated Circuit For Enhanced Signal Stability
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ZCB104-Digital DVI Engineering Cable with IC Specifications: Conductor Core: 18+1 Oxygen-Free Copper Shielding: 128 Braided Mesh + Aluminum Foil + Ground Wire Chip: PI 3HDX511 Cable Diameter/OD: 8.0mm Outer Jacket: Eco-friendly PVC Magnetic Ring: No ......
HANGZHOU ZION COMMUNICATION CO., LTD
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Hard Gold 2 Layer Pcb Board KB6160A FR4 Material Wire Bonding UL Certificate
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...: L1-L2 Min Trace: 4/4Mil Copper: 1/1OZ Solder Mas: Green Surface Treatment: ENIG(1U')+Hard Gold(10U') Application: LCD Module IC Treatment: Wire Bonding Unit Size: 120mm*50mm/3pcs Our Factory: FAQ: Question: What is...
Witgain Technology Ltd
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