Premium Ultra Fine Wire Gold Bonding Wire for Advanced Electronic Bonding Applications
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... in-house capabilities, which encompass casting, drawing, annealing, and A2LA-accredited analytical methods, guarantee the delivery of homogeneous, high-purity wire. This wire not...
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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5.0 - 7.0kg/Cm2 Electronic Dispensing Machine For Wire Bonding Gold Wire Encapsulation
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Inline Visual Dispensing Machine for Wire Bonding Gold Wire Encapsulation The GS600M Inline Visual Dispensing Machine is a precision-engineered inline dispensing solution designed to meet the ultra-high requirements of gold wire encapsulation in advanced ......
Changzhou Mingseal Robot Technology Co., Ltd.
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20-30LM 1W LED Chip 300mA LED SMD 3V Gold Wire Bond
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...Electronic power 1W Color temperature 460-470nm VF 3.0-3.4V IF 300mA Circuit 1PCS in series 1PCS in parallel LUMINUOUS EFF 20-30LM WHOLE SIZE 3.0*3.0mm LENS Silica sphere surface VIEW ANGLE 120° Design Advantage : PCT leadframe for better heat transfer. Standard A Class chips. Cost performance. Gold wire bond. Special lens for light ......
Shenzhen Learnew Optoelectronics Technology Co., Ltd.
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Module Hermetically Sealed Electronic Packages
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Main performance parameters Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness:> 0.45μm Hermeticity: leak ......
JOPTEC LASER CO., LTD
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OEM Immersion Gold Round PCB SMT Assembly Services with Wire Bonding
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OEM Chip On Board Assembly and SMT Assembly services / Immersion Gold PCB Boards with Wire Bonding services PCB Assemlby services including: * Electronic Design Engineering * PCB Design and Layout * Complete PCB Fabrication * Custom & High Temp materials......
Huaswin Electronics Co.,Limited
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Single Pin Hermetically Sealed Electrical Connectors For Electronics Packages JMC-657-JH
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Nail Head Gold Wire Bonding Glass To Metal Seal For Electronics Packages Glass Beads/ Hermetic Glass to Metal Seals RF/DC Feedthroughs is also called Glass insulator. They are mainly used to transmit ......
Xi'an Elite Electronic Industry Co., Ltd.
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wire bonding memory substrate with gold plating manufacture
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Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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