Wholesaler UL Recognized CPU Display Card Thermal Gap Filler Pad Heat Sink Thermal Pad
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...Thermal Gap Filler Pad Heat Sink Thermal Pad Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Electrical Heat Sink Thermal Pad Silicone Rubber Heat Dissipation
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... 0.5mm-15mm Silicone Thermal Pad with Moldability and Double-sided Adhesive The Silicone Thermal Pad is a high-quality heat sink thermal pad made from high temperature silicone rubber material. It is designed to provide superior performance in heat ......
Shenzhen Antac Technology Limited
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TIF200-08-04U UL recognized CPU Display card Thermal Gap Filler Pad Heat Sink Thermal Pad
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...Thermal Gap Filler Pad Heat Sink Thermal Pad Product descriptions TlFTM200-08-04U is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Thermal Conductivity 8.0W/m-K Heat Sink Thermal Pad for Electronic Devices CPU PC GPU
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...Heat Sink Thermal Pad for For Electronic Devices Ziitek TIF7100Q is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF7100Q is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Laptop GPU CPU VGA Chip RAM Heat Sink Sheet , 1.2kg Aluminum Heat Sink Thermal Pad
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Aluminum Heat sink thermal Pad for Laptop GPU CPU VGA Chip RAM Heat sink sheet Quick Details: Material: aluminum (stainless steel, Iron, brass) Machining process: stamping machining (punching lathe 40T, five sets) Finishing: Polishing, Silver oxidation, ......
LiFong(HK) Industrial Co.,Limited
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Multipurpose silicone Heat Sink Thermal Pad practical 1.2 W/m.K
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TP 120 Series 1.2 W/m.K thermal conductivity pad for electronics heat transfer Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 Hardness (Shore OO) 20±5 ......
Shenzhen Aochuan Technology Co., Ltd
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Aluminum Alloy Welded Heat Sink Metal Heatsink 0.5mm 0.8mm 1.0mm 2.0mm 2.5mm
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Aluminum Alloy Welded Heat Sink Factory Direct Sales High-Quality Description: A heatsink is used to dissipate heat generated by electronic components. It is made of materials like aluminum or copper with high thermal conductivity and designed with fins......
Beijing Oriens Technology Co., Ltd.
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Black High Heat graphite thermal pad 0.1mm thick 400 Centigrade
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Thermal Interface Material High Heat Conductivity Black Graphite These products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat conductivity and compatible surface ......
Boalv New Material Technology Co., Ltd.
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2mm Fin Pitch Customized Forging Heat Sink With 0.4°C/W Thermal Resistance
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...superior forging technology. It is made of aluminum alloy and has a fin thickness of 0.5mm, providing a thermal resistance of 0.4°C/W. This heat sink is designed for LED lighting applications, and is customized to meet the specific requirements for each...
Dongguan Fodor Technology Co., Ltd
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0.2-20mm Soft Heatsink Thermal Pad , 6KV High Voltage Silicone Thermal Pad
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...Heat Sink Thermal Conductivity UL Certificated Thermal Silicone Pad LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal......
SZ PUFENG PACKING MATERIAL LIMITED
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