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Hydrophilic Bonding Wafer Bonder Equipment

1-10 Results for

hydrophilic bonding wafer bonder equipment

from 22 Products

Wafer Bonder Equipment Room Temperature Bonding Hydrophilic Bonding For 4 6 8 12inch SiC-Si SiC-SiC

China Wafer Bonder Equipment Room Temperature Bonding Hydrophilic Bonding For 4 6 8 12inch SiC-Si SiC-SiC on sale
...silicon carbide (SiC) wafers, supporting both room temperature bonding and hydrophilic bonding techniques. It is capable of handling wafers of 4-inch, 6-inch, 8-inch, and 12-inch sizes, and is optimized for SiC-to-Si and SiC-to-SiC bonding applications....
SHANGHAI FAMOUS TRADE CO.,LTD

Address: Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799

Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch

China Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch on sale
Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding Equipment is a high-end bonding equipment specifically designed for silicon carbide (SiC) power device manufacturing, supporting 2 to 12-inch wafer specifications. Wafer Bonding Equipment incorporates advanced room-temperature direct bonding and surface-activated bonding......
SHANGHAI FAMOUS TRADE CO.,LTD

Address: Room.1-1805,No.1079 Dianshanhu Road,Qingpu Area Shanghai city, China /201799

Semiconductor Die Bonding Machine Packaging Equipment LED Die Attach Die Bonder

China Semiconductor Die Bonding Machine Packaging Equipment LED Die Attach Die Bonder on sale
...Equipment/led/high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Suitable for: SMD HIGH-POWER COB,part COM in-line package etc. 1,Full automatic up load and down load materials. 2,Module design,max optimization structure. 3,Full intellectual property right. 4,Picking die and Bonding die dual PR system. 5,Multi-wafer ring,dual glue ect configuration. Wafer Stage System The wafer......
Shenzhen Wenzhan Electronic Technology Co., Ltd.

Address: 301A, Bldg. D, No. 50, Nanhuan Road, Shiwei Community, Matian Street, Guangming Dist., Shenzhen, Guangdong, China

Bonding bonder equipment

China Bonding bonder equipment on sale
Bonding machine for LCD Refurbishment, Fog/FOB Bonding Machine, bonding equipment, bonding machine, FOB bonding machine, bonder machine, bonder equipment, 2014 hot selling! Mobile Phone LCD Bonding Machine OCA Glass Laminating Machine with Vacuum. 2014 Most Beautiful LCD Bonding Machine for LCD OCA Glass .Laminating for Iphone 4 5 Samsung S1 S2 S3 S4 S5 Note 1 Note 2 Note 3. Touch panel vacuum bonding machine bonding......
Shenzhen Sunsom automatic equipment Co.,Ltd .

Phone: 86-755-29960797

Address: 4/F, Block C, Liyue industrial park, Fenghuan,Fuyong ,Bao'an , Guangdong,China

Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment

China Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment on sale
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation ......
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Address: Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China

Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade

China Electroplated Bond Wafer Dicing Saw , Thin Type Custom Size Dicing Saw Blade on sale
Electroplated bond diamond blades Hub Blade with Hub HT-YB series The HT-YB series diamond abrasive blade is one specific type of electroplated hub dicing blades we supply. It is a high-end diamond cutting tool designed using advanced technology and ......
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Address: 176#, The 7th Street, Economic & Technological Development Area. 450016, Zhengzhou, China

High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder

China High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder on sale
... with a docking station, facilitate operator operation and connection, improving production cycle time; ● Utilizes internationally leading dual die bonding, dual dispensing, and dual wafer search systems; ● Utilizes a direct-drive motor to...
Shenzhen Hongxinteng Technology Co., Ltd.

Address: Building No. 142 / B311, Songyu Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen China.

ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine

China ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine on sale
...Bonder And Flip Chip Bonder Machine ASM NANO Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder Machine Infinite Automation is the best choice if you are looking for dependable Factory Automation Machines and Production Equipment. Among Our offered machines are original and pre-owned Die Bonding and Die Attach, Wire Bonding, Die Bonder and Flip Chip Bonder......
INFINITE AUTOMATION CO ., LIMITED

Address: Rm. 201, Building 20, Tantou Western Industrial Park, Shajing, Bao an District, Shenzhen, China

18650 battery aluminium wire bonding machine best price automatic wire bonder for battery pack production line

China 18650 battery aluminium wire bonding machine best price automatic wire bonder for battery pack production line on sale
High Quality Automatic ultrasonic wire bonder for battery pack Equipment basic working principle: After the module assembly process is completed, the equipment is used to automatically load the system, and then sent to the welding area through the ......
Shenzhen Onetop Technology Co.,Ltd

Address: No.410, Donghuan Road,Shiajing ,Baoan District Shenzhen China

Metal Welding Ultrasonic Wire Bonding Machine 6000W 20kHz

China Metal Welding Ultrasonic Wire Bonding Machine 6000W 20kHz on sale
... structure can be equipped with 3.6kW and 6.0kW ultrasonic generators. The ultrasonic generator for the system belongs to the ultrasonic digital one, which can communicate between the power box and controller to digitally input all bonding parameters. Many...
K&M TechnologiesCo., Ltd

Address: No. 518, Weijing Road, Qiandeng Town, Kunshan , Jiangsu Province,China
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