Wafer Bonder Equipment Room Temperature Bonding Hydrophilic Bonding For 4 6 8 12inch SiC-Si SiC-SiC
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...silicon carbide (SiC) wafers, supporting both room temperature bonding and hydrophilic bonding techniques. It is capable of handling wafers of 4-inch, 6-inch, 8-inch, and 12-inch sizes, and is optimized for SiC-to-Si and SiC-to-SiC bonding applications....
SHANGHAI FAMOUS TRADE CO.,LTD
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ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine
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...Machine Die Bonder And Flip Chip Bonder Machine ASM NANO Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder Machine Infinite Automation is the best choice if you are looking for dependable Factory Automation Machines and Production Equipment. Among Our offered machines are original and pre-owned Die Bonding and Die Attach, Wire Bonding, Die Bonder and Flip Chip Bonder Machines......
INFINITE AUTOMATION CO ., LIMITED
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Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch
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Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding Equipment is a high-end bonding equipment specifically designed for silicon carbide (SiC) power device manufacturing, supporting 2 to 12-inch wafer specifications. Wafer Bonding Equipment incorporates advanced room-temperature direct bonding and surface-activated bonding......
SHANGHAI FAMOUS TRADE CO.,LTD
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TFT FPD Repair Bonder Machine
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TFT FPD Repair Bonder Machine 1、 About the application field of TFT FPD Repair Bonder machine equipment XCM71 - A6 TFT FPD Repair Bonder machine is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as: ......
Shenzhen Sunsom automatic equipment Co.,Ltd .
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Hot Bar Soldering Thermode Bonding Machine Turnable Station,Hot Bonder Machine
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... precision, the load evenly, to eliminate internal stress 2. Safe, easy to operate 3. Electronic component won't short circuit Specification: welding machine 1....
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine
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Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types......
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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Semiconductor Die Bonding Machine Packaging Equipment LED Die Attach Die Bonder
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...Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Suitable for: SMD HIGH-POWER COB,part COM in-line package etc. 1,Full automatic up load and down load materials. 2,Module design,max optimization structure. 3,Full intellectual property right. 4,Picking die and Bonding die dual PR system. 5,Multi-wafer ring,dual glue ect configuration. Wafer Stage System The wafer......
Shenzhen Wenzhan Electronic Technology Co., Ltd.
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High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder
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... with a docking station, facilitate operator operation and connection, improving production cycle time; ● Utilizes internationally leading dual die bonding, dual dispensing, and dual wafer search systems; ● Utilizes a direct-drive motor to...
Shenzhen Hongxinteng Technology Co., Ltd.
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High Precision LCD Panel Repair Machine , Acf Bonding Machine Touch Screen
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...Bonding LCD Repair Machine LCD Bonding Machine The LCD Repair Bonding Machine is also known as Pulse Heat Bonding Machine, Pulse Heat Hot Bar Machine, and ACF (Anisotropic Conductive Film) Bonder, which can be used on LCD ACF/COF/TAB repair. It is most common machine on LCD repair process, can re-bond or replace new COF/TAB. Model NO. 616DH Use LCD Screen Repair Tab Bonding Other Name LCD Repair Bonding Machine...
Guangzhou Chuang Li You Machinery Equipment Technology Co., Ltd
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Metal Welding Ultrasonic Wire Bonding Machine 6000W 20kHz
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... with 3.6kW and 6.0kW ultrasonic generators. The ultrasonic generator for the system belongs to the ultrasonic digital one, which can communicate between the power box and controller to digitally input all bonding parameters. Many...
K&M TechnologiesCo., Ltd
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