Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch
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Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding Equipment is a high-end bonding equipment specifically designed for silicon carbide (SiC) power device manufacturing, supporting 2 to 12-inch wafer specifications. Wafer Bonding Equipment incorporates advanced room-temperature direct bonding and surface-activated bonding......
SHANGHAI FAMOUS TRADE CO.,LTD
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Wafer Bonder Equipment Room Temperature Bonding Hydrophilic Bonding For 4 6 8 12inch SiC-Si SiC-SiC
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...silicon carbide (SiC) wafers, supporting both room temperature bonding and hydrophilic bonding techniques. It is capable of handling wafers of 4-inch, 6-inch, 8-inch, and 12-inch sizes, and is optimized for SiC-to-Si and SiC-to-SiC bonding applications....
SHANGHAI FAMOUS TRADE CO.,LTD
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Soft feeling and hydrophilic spun bonded pp non woven fabric for hygienic products
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Soft feeling and hydrophilic spun bonded pp non woven cloth for hygienic products Quick Detail: Material 100% Virgin Polypropylene Nonwoven Technics Spun-Bonded Pattern Embossed/Seasame Width 5-320cm/ 2”--126” Weight 10-150gsm MOQ 1500Kilograms Color ......
Foshan Rayson Non Woven Co.,Ltd
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Digital Display Temperature Control Gas Monaka Wafer Production Equipment For Consistent Production Needs
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...Gas Monaka Wafer Production Equipment For Consistent Production Needs Product Description: The Automatic Monaka Wafer Production Line is a cutting-edge solution for producing delicious wafer biscuit, making it an essential piece of equipment for snack food......
GUANGZHOU CITY PENGDA MACHINERIES CO., LTD.
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Wafer Bonding 365nm 20W/Cm2 550 w UV Led Curing Oven
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...wafer oven UV LED wafer debonder machine wafer debonding Adhesive Peeling dessolver equipment Type: UV Lamp Light Power Intensity: 1-20W/cm2 Weight: 10 KG Power: 550w Warranty: 1 Year Cooling Method: Air Cooling Wavelength: 365nm Size: 366*158*360mm/customized Control Method: ON/OFF,PLC Selling Units: Single Item Product Application UV Printing,UV Glue,UV Adhesive,UV Bonding......
Shenzhen Bird UV Technology Co.,Ltd
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4H N Type SiC , Dummy Grade , 6”Size For Wafer Or Equipment Running Test
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... and industry manufacturers. We has developed SiC crystal growth technology and SiC crystal wafer processing technology,established a production line to manufacturer SiCsubstrate,Which is applied in GaNepitaxydevice,powerdevices,high-temperature device and...
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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63 Plates 220kg/Hr Wafer Biscuit Equipment , Biscuits Maker Machine
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High Quality Automatic Wafer Making Machine / Wafer Line / Wafer Biscuit Making Machine Product Description Skywin is Professional Manufacturer specilized in Wafer machine,Wafer biscuit production line. It is full automatic control whole line. Our factory......
Skywin Foodstuff Machinery Co., Ltd.
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PLC Control Cone Ice Cream Machine , Sugar Cone Wafer Processing Equipment
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PLC Control Cone Ice Cream Machine , Sugar Cone Wafer Processing Equipment Cone Ice Cream Machine Introduction Tunnel-type full automatic sugar cone making machine is a kind of machine which controlled by PLD,with complete automatization ,high capacity......
Guang Zhou Jian Xiang Machinery Co. LTD
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Labor Saving O Ring Bonding Equipment For Lunch Box Or Thermal Cup Seal O Ring Material Production
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...Bonding Equipment For Lunch Box Or Thermal Cup Seal O Ring Material Production Product Description: The O Ring Bonding Machine is a highly efficient production machine designed for the automatic cutting and bonding of all O-rings. It has a cycle of operation of 12-15 seconds per piece, and can be customized to meet various weight requirements. It is also known as a Butyronitrile Ring Making Machine, Rubber ring bonding......
Guangzhou Hengchao Automation Technology Co., LTD
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Automatic Suction Connecting Pipe Automatic Bonding Equipment For Medical Extension Tube Assembly
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Suction Connecting Pipe Automatic Bonding Equipment, Pipe Length Can Be Customized Equipment function: Automatic gluing and bonding equipment for 1.7-1.5m connecting pipes. The equipment is directly connected to the extruder, and the manipulator ......
Suzhou Jiezhicheng Automation Technology Co., Ltd.
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