BGA IC Package Substrate With Cap Plated MGC BT material
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Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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... annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF Plate thickness: 0.15mm, Panasonic material PIGL042504......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Packaging Cans Crown Caps Tinplate Sheets Tin Coating Weight 5 to 40 Gm2 Hardness T2 Designed for Strong Metal Containers
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Product Description: Tinplate Sheets are high-quality Tin Plated Steel Sheets widely used across various industries due to their excellent properties and versatile applications. These sheets are manufactured through an electrolytic process, resulting in ......
SHANGHAI QUANYE METAL PACKAGING MATERIALS CO.,LTD
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Straight Pins Opto Electronic Metal TO46 Package Header
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Product model: TO-46 Product name: Suitable Coining Round Styles Pedestal Leads Are Perpendicular To The Substrate Mounting Surface Finish: Fully plating Au.(Finish could adopt fully plating or selective plating.) Plating coating: Bottom plate, lead ......
JOPTEC LASER CO., LTD
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