6.0Mpa Low Thermal Expansion Precoated Resin Sand
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... phenolic resin, methenamine and enhancers as raw materials. Depending on the technology needs of users, the curing speed, stripping, flowability, collapsibility, the casting surface finish, storage of silica resin coated sand can be adjusted and...
Qingdao Jinjunxuan International Trade Co., Ltd.
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High Transmittance Low Temperature Conductive Adhesive Glue 0.3W / mK TIS280-03A/B
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High Transmittance Low Temperature Conductive Adhesive Glue 0.3W / mK TIS™ 280-03AB is a two-component,high transmittance, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue.This potting glue to apply on ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Super dielectric performance epoxy resin compound for making durable insulators
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... epoxy resin. LH-9205 is a liquid modified carboxylic anhydride hardener with an added accelerator. LF-660 is a low-viscosity solvent-free modified polyol. LZ-630 is a modified tert-butylamine. Super dielectric performance epoxy resin compound for making......
Shanghai Wenyou Industry Co., Ltd.
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Insulation Clear Liquid Epoxy Resin Hardner , Potting Casting Epoxy Resin Compound
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... Used for:low voltage CT(and zero-sequence instrument transformers) electronic components such as: ignition, regulator, electronic transformers, network transformers, pump ......
JIANGTE INSULATION COMPOSITE
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2K Dosing System with Thermally Conductive Epoxy Silicone Compound Potting Machine
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...Thermally Conductive Epoxy Silicone Compound Potting Machine Potting is a method for processing resins based on silicone, polyurethane or epoxy in liquid form to cover electrical components such as PCBs or for filling out cavities. The precise operation of metering and mixing systems is particularly important for resin......
Kapudun Automation Equipment (Guangzhou)CO.,ltd
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Chemically Resistant High Strength 100% 3K Carbon Fiber Panel Low Thermal Expansion
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...Low Thermal Expansion The carbon sheets/panels are laminated with high-strength carbon fibers and epoxy resin. The top layer has an attractive carbon look. The carbon sheets have optimal strength and stiffness, due to the placement direction of the fibers. The carbon material is chemically resistant, exceptionally dimensionally stable, and nearly insensitive to shrinkage or expansion...
SHANGHAI LIJIN IMP.&EXP. CO.,LTD
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Purple 100mm Thickness High Temperature Board Low Thermal Expansion
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Purple color Length1500*500* width thickness 50-100mm Coefficient of thermal expansion low high temperature board High density polyurethane PU board A board machined by numerical control High density polyurethane board is used for NC machining. LH-TOOL ® ......
Yongzhou Lihong New Material Co.，Ltd
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PCTFE Polymer Resin Low Thermal Expansion Excellent Gas Barrier For Medical Aerospace
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1. Product Description PCTFE (Polychlorotrifluoroethylene) resin is a high-performance fluoropolymer known for its exceptional moisture barrier properties, ultra-low gas permeability, and excellent clarity. It offers outstanding chemical resistance, ......
Shenzhen Teflon New Material Technology Co., Ltd
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TIE280-12AB Thermal Conductive Glue Electronic High Thermal Conductive Potting Epoxy Resin Adhesive
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... cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices. Features > Good thermal conductive: 1.2W/mK > Excellent insulation and smoothly sourface. > Low shrinkage > Low viscosity,...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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4.5W/MK Thermal Conductive Glue Material Conductive Epoxy Resin Potting Compound Adhesive Gel
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...Thermal Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance TIETM380-45 is a one component, heatcured epoxy adhesive. lt has excellentthermal conductivity and bond strength. TIETM380-45 is a good choice for highspeed production lines because it hasthe rheology to allow stencil printing anda fast, one component, heat cure. TIE380-45-TDS_EN_REV01.4.pdf Feature > Good thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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