CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
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mobile phone COF driver Panasonic material PIGL042504-250MH, CU9/1um, Baoli oil + PI reinforcement Product Description Number of floors: 1 floor Plate thickness: 0.15mm, Panasonic material PIGL042504-250MH, CU9/1um, Baoli oil + PI reinforcement, minimum ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2
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...interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving high-density interconnections between chips, as well as between chips and substrates. While TSV (Through Silicon Via) technology is used for interposers in silicon-based substrates......
SHANGHAI FAMOUS TRADE CO.,LTD
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Laser Wavelength 355 Nm Ceramic Substrates Featuring UV Laser Technology and Cells Density 100 to 600 CPSI Suitable for Precision Manufacturing
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...Substrate is an advanced material designed to meet the demanding requirements of modern electronic applications, particularly in power electronics. This product is primarily used as a MOSFET Power Module Substrate, providing an essential platform for mounting and interconnecting......
Jiangsu Province Yixing Nonmetallic Chemical Machinery Factory Co.,Ltd
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Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
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... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant electrical characteristics by short interconnection paths.SiP is a substrate that enables to combine 2 or...
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Dual-Station R&D Coater for Multi-Substrate Testing | Flexible Platform for Molded Pulp & Beyond
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Dual-Station R&D Coater for Multi-Substrate Testing | Flexible Platform for Molded Pulp & Beyond 1. Composition of Production Line A highly flexible platform featuring: two independently operable spin stations on a linear slide, a library of ......
Dongguan Osmanuv Machinery Equipment Co., Ltd
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Zirconia ZrO2 Ceramics Substrate Sheets Plates
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... close to that of steel. Mainly: Y-TZP grinding ball, dispersion and grinding media, nozzle, ball valve ball seat, zirconia mold, micro fan shaft, fiber pin, fiber sleeve, wire drawing die and...
Wuxi Special Ceramic Electrical Co.,Ltd
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Customized 2D3D Drawing Overmolding Injection Molding Services Delivering Mould Precision Plus or Minus 005mm and Mold Surface Treatment Texture for Parts
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...Molding is an advanced manufacturing process that combines multiple materials or colors into a single, cohesive product through the use of sophisticated injection mold molding techniques. This process is highly valued for its ability to enhance the functionality, aesthetics, and durability of plastic components by integrating a secondary material or layer onto a primary substrate......
Qunhe Precision Mould Co., Ltd
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100mm/S Speed Semiconductor Molding Machine Chip Molding Equipment Energy Saving
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...Molding Equipment Features: ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● Applicable leadframe/substrate......
Guangdong Taijin Semiconductor Technology Co., Ltd
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Overmolding Injection Molding Mold Accurate Plastic Injection Mold Tooling Customizable
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...substrate with a layer of soft plastic or rubber, giving the finished product both mechanical strength and a comfortable feel. It is widely used in the manufacture of high-end plastic products. Process Flow Mold design and overmolding structure determination Mold flow analysis to predict flow and adhesion CNC and EDM precision machining Mold......
MID Mould Industrial Ltd.
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718H S136 P20 P20H Plastic Injection Moulds With 2K Bezel substrate
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...-made plastic injection molding service molded plastic parts Mold Material S136/2344/718/738/NAK80/P20, etc. Plastic Material ABS, PP, PC, PVC, POM, TPU, PC, PEEK,HDPE,NYLON, PA6+30%GF, PA66, Silicone, Rubber, etc. Mold Base LKM,...
Shenzhen Benky Industrial Co., Ltd.
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