Halogen Free Thick Copper Metal Substrate PCB 10 Layers Level 2 HDI PCB HDI FR-4 TG150
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10 layers Level 2 HDI Large Industrial communication PCB HDI FR-4, TG150 Halogen-free Thick copper + thick goldinner and outer copper ,HDI Printed Circuit Boards,prototype pcb fabrication Product Description Product area: Inductive drive products Number......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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25um PTH Substrate HDI Multilayer FR4 Board 2OZ Cu 8 Layer
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Custom OEM Design Multilayer FR4 Substrate HDI Board 1. High density interconnect board. 2. Consumer electronics usage. 3. FR4 94-V0 grade. 4. Up to 3+X+3. 5. Immersion gold coating. 1 Layer 8 2 Substrate FR4 94-V0 3 PCB thick 1.57mm 4 App Consumer ......
Abis Circuits Co., Ltd.
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1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate
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HDI PCB 10 Layer 1.0MM Thickness Immersion Gold 2U' FR4 Substrate PCB Specifications: 1 Part NO: HDIPCB0005 2 Layer Count: 10 Layer HDI PCB 3 Finished Board Thickness: 1.0MM 4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM......
Witgain Technology Limited
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Anylayer 0.5OZ Copper HDI Printed Circuit Board PCB 0.8mm Customized
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Thin Copper Foil Substrate HDI PCB High Integration Can be Used for Medical Equipment ♦ What is HDI PCB? HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up ......
DQS Electronic Co., Limited
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FMC substrate manufacture supporting
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...Substrate pcb IC substrate, also known as packaging substrate, is an important raw material for integrated circuit packaging, to provide electrical signals for the chip out and support the role of heat dissipation and protection IC substrate is developed from HDI board, according to the packaging mode can be divided into BGA packaging substrate CSP packaging substrate FC packaging substrate MCM packaging substrate......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 1.1 General description This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's......
Shenzhen Bicheng Electronics Technology Co., Ltd
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12 Layers HDI 2+N+2 Stacked holes PCBs
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...Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB,HDI,IMS and Ceramic PCB,Rigid-Flex PCB, IC Substrate PCB,PCB layout and design and PCB assembly.2. Material Type: FR4,non-halogen material ,......
LT CIRCUIT CO.,LTD.
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold 1.1 General description This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's......
Bicheng Electronics Technology Co., Ltd
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ISO9001 HDI FR4 1.2mm 1.6mm FR4 94v0 Circuit Board
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... Board, Flexible Board, High Frequency Board, HDI PCB board, Aluminum Substrate . Haina lean Electronics Co., Ltd is one of the most professional PCB manufacture in Beijing,China.With 9 years of development, Haina Lean Electronics turns into a first...
Beijing Haina Lean Technology Co., Ltd
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates and HDI......
JIMA Copper
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