Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating
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Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad With Naturally Tacky Needing No Further Adhesive Coating Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF100-02F Notebook Thermal Gap Filler 1.5W Silicon Thermal Pad
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... retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductive 1.5W/mK > Moldability for complex parts > Soft and...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Ultrasoft CPU Heatsink Green 3.0W / m - K silicone thermal gap filler TIF100-30-07E with 35shore00 -50 to 200℃
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... thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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2 W / M * K Thermal Gap Filler Pads For Lithium Battery Pack Cooling Plate
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...Thermal Gap Filler Pads For Lithium Battery Pack Cooling Plate Discription of Thermal Gap Filler Pads: Thermal Gap Filler Pads is generally located between the liquid cooling plate and the cell pole, which can effectively exclude air and achieve good filling and Thermal Gap Filler Pads effects. In addition, it also has good insulation and voltage resistance characteristics and temperature stability, safe and reliable use. Thermal Gap...
Trumony Aluminum Limited
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Heatproof Single Thermally Conductive Filler , Anti Corrosion Thermal Gap Filler
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...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K) 3.0...
Shenzhen Aochuan Technology Co., Ltd
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Thermal Gap Filler Thermal Conductive Material Thermal Pad 30 seconds Hardness
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... of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. A-gapfill 600 is naturally tacky and...
Adcol Electronics (Guangzhou) Co., Ltd.
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Grey Thermal Gap Filler Pad Material Silicone Based Thermal Conductivity
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... Based Thermal Gap Filler Thermal Pad Laird Thermal Conductivity 7.5W/Mk Grey High Deflection Product Description Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity......
ZSUN CHIPS CO., LTD
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1.4W/M.K LED Thermal Interface Pad , Conductive Thermal Gap Filler Pad Reusable
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... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *...
SZ PUFENG PACKING MATERIAL LIMITED
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Thermal Insulation Battery Interface Thermal Gap Filler Pad Flame Retardant
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Battery Thermal Management System Thermal interface gap pads flame retardant properties good thermal insulation Description It is a thermal insulation structural part product. It has the characteristics of high heat preservation, high flame retardancy and ......
Fuzhou Fuqiang Precision Co., Ltd.
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0112 Silicone Thermal Grease 1.6W/M·K Eco-Friendly Odorless Gap Filler For CPU Or LED Chip Thermal Conductivity
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0112 TDS-EN.pdf 0112 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product Features: One-component, white; Physical form: paste; Wide working temperature range; Nontoxic......
Shanghai Huitian New Material Co., Ltd
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