High Thermal Conductivity Low Melting PCM Thermal Interface Material for Netbook and Desktop
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...Thermal Conductivity Low Melting PCM Thermal Interface Material for Netbook and Desktop Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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0.23mm Silicon Coated Heat Conductive Material PC Power Thermal Interface
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...Material PC Power Thermal Interface These heat conductive silicon products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat conductivity and compatible surface characteristic. Another product is Pyrolytic Graphite Sheet, it is a thermal interface material which is very thin, synthetically made, has high thermal...
Boalv New Material Technology Co., Ltd.
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30℃ Phase Change Material PCM Thermal Storage Material Building Energy Storage Raw Material Cold Chain Transportation
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...Description: 30 degree organic phase change material (PCM) is an ideal product for thermal management solutions. This is because they store and release heat energy during the melting and freezing process (transitioning from one phase to another). When this...
Sichuan Aishipaier New Material Technology Co., Ltd.
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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Silicone Based Thermal Interface Material 8.5W Soft Thermal Pad For Electric Vehicle
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...Thermal Interface Material 8.5W Soft Thermal Pad For Electric Vehicle Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
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High Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and ......
Trumony Aluminum Limited
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TIC800P Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
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...Thermal Interface Materials Thermal Phase Changing Material The TIC™800P series is low melting point thermal interface material. At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
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5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
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Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
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Thermal Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has ......
ZSUN CHIPS CO., LTD
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ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease
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... with a pre-flash viscosity of 80 Pa·s, post-flash viscosity of 700 Pa·s, thermal conductivity of 6.2 W/m·K, thermal resistance of 6.1 mm²·K/W, and bond line thickness of 26 μm. Product Overview Optimized for screen printing, stencil printing,...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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