CNC PEEK IC Test Socket Package Guide Insert for BGA Testing
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...o position, while the mounting features locate the insert within the socket assembly before electrical contact is made. PEEK provides a lightweight engineering polymer option with good machinability and dimensional stability. If electrostatic control or...
Dongguan Shiye Hardware Technology Co., Ltd.
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Stable Transmission IC Test Sockets Semiconductors Industry Testing Socket
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IC Test Socket Leading Semiconductor Brand — Yiding Technologies In the fast-evolving semiconductor industry, Yiding Technologies stands at the forefront with precision engineering and innovative solutions, delivering high-frequency test sockets and comprehensive semiconductor application services. Our Services Semiconductor Manufacturing & Processing Test Fixtures & Spring Probes Vertical Probe Cards High-Frequency Test Socket Automated Test...
Dongguan Yiding Technologies Co., Ltd.
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QFN52 Burn in Socket MLF52 IC Test Socket Pitch 0.4mm Alloy Clamshell Chip Size 6*6 Flash Adapter Programming Socket
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...Socket QFN52 MLF52 IC Test Socket Pitch 0.4mm Alloy Clamshell Chip Size 6*6 Flash Adapter Programming Socket Product Features: a.Clamshell structure burn in socket b.Adopting engineering material for socket structure, Strength is high ,lifetime is long c.Adopting import BeCu material for socket contact Spring ,thickening gold-plating surface ,impedance is small elasticity is good d.For 0.4mm pitch package......
Shenzhen hongyi electronics Co.,LTD
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2.54mm IC Test Socket / Zif Type Connector With Center Distance 7.62 / 15.24mm
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... force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is...
Ningbo Anyo Import & Export Co., Ltd.
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OTQ44-0.8-14,QFP44 Programmer ,IC test socket, flash
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... work temperature : -60~155 degree ITEM : QFP-44-0.8 PIN distance : 0.8mm , 44 pin IC size : 10*10mm/12*12mm we have too many kinds of test socket didn't show here . we can also do OEM socket for the customers . please welcome to contact with us for detail...
HUANGU Electronic Tech co.,ltd
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Peek Machining BGA Test Socket Part Aperture 0.05mm Tolerance + / - 0.008
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Peek Machining BGA Test Socket Part Aperture 0.05mm Tolerance + / - 0.008 Item cnc machining Material PEEK PAI Nylon ,mc nylon, POM,ABS,PU,PP,PE,PTFE,UHMW,PE,HDPE,LDPE, PVC,etc. Color Black, white, red, green, transparent or any color according to Pantone ......
SuZhou BiUlU technology Co.,Ltd
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PH1.27 PGA Female Socket CPU Test Socket board connector PGA test socket Machined Contact
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... in a grid pattern. These sockets allow for reliable electrical connections and easy insertion/removal of PGA-packaged chips. Common pitch sizes include 1.27mm to 2.54mm, and they are widely used in CPU testing, programming, and burn-in applications where...
SHENZHEN JRKCONN ELECTRONICS CO.,LTD
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QFN test sockets including 3M 264-4205-00 designed for 0.4 mm and 0.5 mm pitch package testing
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...Sockets for QFN Applications are designed for testing and burn-in of Quad Flat No-lead (QFN) packages. This product family includes sockets for 0.4 mm and 0.5 mm pitch QFN devices, utilizing a common contact for both pitch offerings. These sockets are engineered for reliable performance in demanding test environments, as demonstrated by evaluation reports focusing on actuation force, contact force, IC...
Shenzhen ECER Network Technology Co., Ltd.
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Plastic Injection Molding Process For Injection PEI BGA Test Socket
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... for injection PEI BGA test socket We have multiple types of molds available:Medical products, precision electronics,Arospacemachinerymold,Petrochemicalindustrymold, Machinemanufacturingmold Mold for special engineering plastics:PEEK,PEI,PPSU,PSU,......
Dongguan Pruisi Plastic Materials Co., Ltd
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Wide Process Window 0.03mm Pd Coated Copper Wire BGA Semiconductor Test Socket Bonding Wire
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Wide Process Window 0.03mm Pd Coated Copper Wire BGA Semiconductor Test Socket Bonding Wire Adaptable to different bonding machine parameters, high stitch pull strength for BGA semiconductor test socket packaging. Company Information...
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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