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Precision Ic Package Substrate

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precision ic package substrate

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Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant

Precision 0.15mm IC Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate......

HongRuiXing (Hubei) Electronics Co.,Ltd.

Address: Tianyue building 711,518100 shajing centre bao'an district Shenzhen city

2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......

Shenzhen Chaosheng Electronic Technology Co.,Ltd

Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates

...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......

JIMA Copper

Address: No.60 Guoxia Road, Yangpu District, Shanghai,China.

Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof

...Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200......

NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD

Address: Tengjin Technology Park,No.7,Huaguoshan Road,XinAn community,ChangAn,Dongguan,GuangDong,China.

High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders

...Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die bonding technology Bottom photo-taking, high precision......

Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd

Address: Suneast Ind.Park, No.13, Yongping 2nd Rd., Fuyong Street, Bao'an District, Shenzhen city,Guangdong Prov., China

OPA2388QDGKRQ1 Amplifier IC Chips Dual Automotive Qualified Wide-Bandwidth Precision Amplifier Package VSSOP-8

OPA2388QDGKRQ1 Amplifier IC Chips Dual Automotive Qualified Wide-Bandwidth Precision Amplifier Package VSSOP-8 GBP - Gain Bandwidth Product: 10 MHz SR - Slew Rate: 5 V/us CMRR - Common Mode Rejection Ratio: ......

Shenzhen Sai Collie Technology Co., Ltd.

Address: 1702, Dingcheng international building, Zhonghang Road, Futian District, Shenzhen

24 CH Optical Fiber Array With High Precision V-Groove Substrate

24 CH fiber array with high precision V-groove substrate Description: Seacent's fiber arrays are fabricated with high precision V-groove substrate by Browave unique assembly/polish process to get an excellent accuracy of fiber core position and perfect......

Shenzhen Seacent Photonics Co.,Ltd.

Address: 3rd Floor, No. 395 Kejie 2nd Road, Shutianpu Community, Matian Street, Guangming District, Shenzhen ,PRC 518103

IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......

Shenzhen Tecircuit Electronics Limited

Address: Room404,Building A2,Shunjing Pioneer Park,NO3 Longteng 3rd road, jixiang community,longcheng street,longgang district,ShenZhen, China

Universal JEDEC Matrix Tray Stackable For IC Packaging Industry

... Matrix Tray Stackable For IC Packaging Industry Offering both standard and custom configurations, our JEDEC trays meet a wide range of semiconductor packaging needs. This JEDEC matrix tray is crafted for precision and efficiency in electronics component ......

Shenzhen Hiner Technology Co., Ltd.

Address: Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN

Polyimide-film-based, precision-laminated copper substrate for flexible circuits

Polyimide-film-based, precision-laminated copper substrate for flexible circuits Product Overview: The GL series is a leap forward in polyimide film performance. Its proprietary manufacturing process creates a uniquely oriented molecular structure, ......

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Address: No.4266, Dongfang Avenue, Xinzhan District, Hefei, China

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