Precision Ceramic Parts Semiconductor Wafer Chuck
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... distributed pore sizes to assure desirable sucking and holding power for very thin films ,it is widely applied in electronic, semiconductor, ,solar,medical and optical laser microfabrication etc industries. We can custom design per your application to...
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
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Semiconductor Advanced Technical Ceramics Wafer Chucking Substrate For Picking Up Wafer
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... are used to manipulate and carry silicon wafers through the whole production process. The chemical inertness of ceramics allows those components to be contamination-free for the wafer in particular in chemical wet etching baths. These items enable the...
Dongguan Ming Rui Ceramic Technology Co.,ltd
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Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency
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... absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back...
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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Black Indium Phosphide Wafer , Semiconductor Wafer For LD Application
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2inch 3inch 4inch InP substrates for LD application, semiconductor wafer,InP wafer,single crystal wafer InP introduce InP single crystal The tCZ growth (modified Czochralski method) is used to pull a single crystal through a boric ......
SHANGHAI FAMOUS TRADE CO.,LTD
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12 Inch 5nm Semiconductor Wafer Chip Wafer Scrap Laser Chip
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This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers can be removed for uncut material and defective products. Market uses are as follows: 5nm wafer 5NANO technology wafer ......
Shenzhen Chuangying Times Technology Co., Ltd.
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Soi Wafer Silicon on Insulator Semiconductor Wafer
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...Wafer Silicon on Insulator Semiconductor Wafer SOI Wafer (Silicon On Insulator) * SOI Wafer sizes from 3" to 200mm, some in inventory * Very high quality with tight TTV on device layer thickness * Direct Si-Si bonding and double sided SOI available * Any Si orientation, any device thickness over 1.5um * Single and double side polished * Small lot sizes and Laser marking of wafers available * Short lead time delivery TYPES OF SOI WAFER...
Shenzhen A.N.G Technology Co., Ltd
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Orientation111 100 SSP DSP High Purity InP Semiconductor Wafer 6''4'' InP Wafers
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...semiconductor wafers, renowned for their exceptional electronic and optoelectronic properties, have found extensive applications in communications, optics, and electronics. Utilizing advanced growth and processing technologies, we ensure the high purity and uniformity of our wafers......
SHANGHAI FAMOUS TRADE CO.,LTD
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6 Inch 5 Solts Semiconductor Wafer Carrier For Inspection And Transportation In Wafer Fabrication
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...le sheet of wafer film uniform expansion, so that attached to the surface of the film tightly arranged grains pull apart, in order to facilitate solid crystal. At this ......
Shenzhen Hiner Technology Co., Ltd.
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Semiconductor Wafers Ultrasonic Cleaning System 100KW Automated Ultrasonic Cleaner
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...Cleaning System For Semiconductor Wafers Intelligent Cleaning: The equipment adopts a fully automatic feeding and discharging cleaning mode to clean the silicon wafers. Meanwhile, the equipment is compatible with cleaning silicon wafers of various sizes......
guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
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N Type, InAs Wafer, 2”,Prime Grade,Epi Ready-Semiconductor Wafer Manufacturing
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... wafer diameters range from 25.4 mm (1 inch) to 100 mm (6 inches) in size; wafers can be produced in various thicknesses and orientations with polished or unpolished sides and can include dopants. PAM-XIAMEN can produce wide range grades: prime ......
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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