TIF100-50-11S CPU Thermal Pad Silicone Thermal Interface Material 5.0W RoHS Compliant For Cooling Of Automotive Electronics
|
...the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Their flexibility and...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
Electrically Isolating Silicone Thermal Interface Materials For LED Street Lamp
|
Electrically Isolating Silicone Thermal Interface Materials For LED Street Lamp Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA ......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
Silicone Based Thermal Interface Material 8.5W Soft Thermal Pad For Electric Vehicle
|
Silicone Based Thermal Interface Material 8.5W Soft Thermal Pad For Electric Vehicle Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
|
Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
|
5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
|
5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
|
Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
|
Thermal Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance. Features and Benefits Silicone......
ZSUN CHIPS CO., LTD
|
Soft Silicone Thermal Pad Flexible for Enhanced Product Performance and Superior Heat Transfer
|
... in solving heat dissipation problems, is safeguarding numerous electronic devices with its excellent performance. Excellent Material Properties This silicone thermal pad is made of high-quality silicone materials, featuring remarkable softness and...
Shenzhen Antac Technology Limited
|
180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
|
...Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and bonding materials configured in a certain ratio, and processed through a special process to become a paste gap filling material......
Trumony Aluminum Limited
|
ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease
|
... with a pre-flash viscosity of 80 Pa·s, post-flash viscosity of 700 Pa·s, thermal conductivity of 6.2 W/m·K, thermal resistance of 6.1 mm²·K/W, and bond line thickness of 26 μm. Product Overview Optimized for screen printing, stencil printing,...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
|
Silicone Practical Heatsink Cooling Pad , Reach Thermal Interface Material Pad
|
0.5mm Ultra Soft High Breakdown Voltage 1.0W/m.K Thermal Silicone Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red Visual Thickness(mm) 0.5~12.0 ASTM D374 Density(g/cc) 2.5 ASTM ......
Shenzhen Aochuan Technology Co., Ltd
|
Submit your “soft silicone thermal interface material” inquiry in a minute :