4'' 200nm AlScN On Silicon Wafers SSP DSP Epitaxial Substrates For LED Devices
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4'' 200nm AlScN Template On Silicon SSP DSP Epitaxial Substrates for LED Devices Features: Aluminum scandium nitride (AlScN) on silicon refers to the deposition of a thin AlScN on a silicon substrate. This process involves growing a layer of AlScN material......
SHANGHAI FAMOUS TRADE CO.,LTD
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Copper Substrate Copper Cubic Cu Wafer / Substrate 100 110 111 Orientaiton SSP DSP Purity 99.99%
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copper substrate Copper cubic Cu wafer/substrate 100 110 111 orientaiton SSP DSP purity 99.99% copper substrate's brief Our single crystal copper wafers, with a purity of 99.99%, are engineered to deliver optimal electrical and thermal performance for ......
SHANGHAI FAMOUS TRADE CO.,LTD
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Outer Diameter 185mm Thickness 5.5mm Copper Substrate
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...copper substrate PART 1: Product Description This copper substrate is made of alloy metal friction material with high hardness and strength. It can withstand greater pressure and load during use and is not easily deformed or damaged. This characteristic extends the service life of the copper substrate......
Yuhuan Shenggewang Machinery Co., Ltd
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185mm Copper Substrate 5.5mm Copper Substrate Alloy Metal
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...copper substrate PART 1: Product Description This copper substrate is made of alloy metal friction material with high hardness and strength. It can withstand greater pressure and load during use and is not easily deformed or damaged. This characteristic extends the service life of the copper substrate......
Yuhuan Shenggewang Machinery Co., Ltd
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Thick Copper Substrate PCB Gold Plating Surface Finishing For New Energy Vehicle
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...: 2-4L metal substrate Plate thickness: 25.0mm, Process structure: metal material + deep hole, copper thickness 10OZ-25OZ, 8W+8W glue + PP Surface treatment: electric thick gold 20u Packing: vacuum ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT
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Molybdenum Copper Substrates For Heat Dissipation 1. Information Of Molybdenum Copper Substrates For Heat Dissipation: Molybdenum-copper substrate is a new type of electronic material. It uses molybdenum as the base and copper as the conductive layer. It......
Shaanxi Peakrise Metal Co.,Ltd
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3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT
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Molybdenum Copper Substrates For Heat Dissipation 1. Information Of Molybdenum Copper Substrates For Heat Dissipation: Molybdenum-copper substrate is a new type of electronic material. It uses molybdenum as the base and copper as the conductive layer. It......
Shaanxi Peakrise Metal Co.,Ltd
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OEM design Copper Substrate PCB Led Lamp PCB copper based pcb for Electronics Device
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Copper Substrate OEM PCBA and PCB Board Led Lamp Board A Metal Core PCB (MCPCB) is a type of printed circuit board that has a metal core, typically made of aluminum, copper, as the base material. The metal core provides enhanced thermal conductivity, ......
Shenzhen Hansion Technology Co., Ltd.
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Polyimide-film-based, precision-laminated copper substrate for flexible circuits
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Polyimide-film-based, precision-laminated copper substrate for flexible circuits Product Overview: The GL series is a leap forward in polyimide film performance. Its proprietary manufacturing process creates a uniquely oriented molecular structure, ......
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
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ENIG Copper Substrate PCB High Power LED Thermoelectric Separation
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... Layer Count: 1 Layer Printed Circuit Board Finished Board Thickness: 1.8mm Copper Thickness: 1 Material: Copper Substrate Application Area: Hign Power LED Special Feature: Thermoelectric Separation Surface Treatment: ENIG Our Product Categories:...
Witgain Technology Limited
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