Thermal Gap Filler 1.2w/MK Densentity 2.0 G/Cm3 For RDRAM Memory Modules
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...thermal gap filler 1.2w/MK densentity 2.0 g/cm3 for RDRAM memory modules The TIF120-12-05ES is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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TIF100-01ES Self-Adhesive Thermal Gap Pad 6.0W/M·K Silicone Thermal Pad
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...Thermal Gap Pad 6.0W/M·K Silicone Thermal Pad Product descriptions TlFTM100-07S Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features > Good thermal conductivity 1.5W/mK......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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20 Shore 00 LED Power Supply Applied 2.5mmT Ultra Soft Thermal Gap Pad 4.0W/MK
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20 Shore 00 LED Power Supply applied 2.5mmT ultra soft thermal gap pad Pad 4.0W/MK TIF5100-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Grey Thermally Conductive Gap Filler Pads Electronic Thermal Gap Pad Material
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Thermal Pad Gap Filler Laird Tflex SF10 10 W/Mk Thermal Conductivity Die Cutting...
ZSUN CHIPS CO., LTD
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7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads
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2.0W non silicone thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
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0116 Silicone Thermal Grease 3.2W/M·K Gap Filler For CPU, IGBT, large storage devices, automotive electronics etc.
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0116 TDS-EN.pdf Product Description Silicone thermally conductive compound White paste Non-curing type Product Features Thermal conductivity: 3.2 W/ m·K Solvent-free, metal powder-free for insulation requirements Very small interface thickness and very low......
Shanghai Huitian New Material Co., Ltd
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Thermal Conductive Gap , Thermally Conductive Material Filler Electric Thermal Interface Pads
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...thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. A-gaphite 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24”...
Adcol Electronics (Guangzhou) Co., Ltd.
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1.2 W/m.K Multipurpose Thermal Conductive Pad For Laptop LED Heatsink
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1.2W/m.K Thickness 0.5 mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop LED Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2.3 ASTM D792 Hardness......
Shenzhen Aochuan Technology Co., Ltd
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