0.2mm Ultrathin MEMS packaging substrate fabrication for microphoneµelectronics
|   | 
                                            Ultrathin High Quality MEMS PCB for Microphone Application:MEMS,sensor MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) ......                                         
                                            HongRuiXing (Hubei) Electronics Co.,Ltd.
                                         
 | 
Submit your “ultrathin mems pcb for microphone” inquiry in a minute :
                    
                