Wafer Semicoductor Dicing Saw Blade High Cutting Efficiency For Cutting Hard Quartz
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Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond ......
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting
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...-precision separation of wafers (8"/12") and brittle materials. Utilizing diamond blade technology (30,000-60,000 RPM), it achieves micron-level ......
SHANGHAI FAMOUS TRADE CO.,LTD
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Micro-jet Laser Machine For Metal Matrix Composite Processing Wafer Cutting Dicing Slicing
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...wafer cutting dicing slicing Micro-jet Laser Equipment & Linear Motor for Wafer Dicing and Slicing Product Overview: The Micro-jet Laser Machine is a cutting-edge solution designed for high-precision processing of Metal Matrix Composites (MMCs), along with wafer cutting, dicing......
SHANGHAI FAMOUS TRADE CO.,LTD
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Y-cut and X-cut Lithium Niobate Wafer for Superior SAW Device Performance
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...Wafer for Superior SAW Device Performance Lithium niobate wafers are revolutionizing the optical technology industry with their unique combination of optical, piezoelectric, and ferroelectric properties. These wafers, made from high-quality lithium niobate crystal, offer unparalleled performance in a wide range of applications. Their exceptional optical transparency and refractive index make lithium niobate wafers...
Hangzhou Freqcontrol Electronic Technology Ltd.
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Diamond Dicing Blades Metal Bonded Abrasives Dicing Saw Blade
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Diamond Dicing Blades Metal Bonded Abrasives Dicing Saw Blade Product overview Metal bond dicing blades are made of identical material,with thin thickness and high precision, they are mainly used for grooving and cutting with high accuracy and narrow ......
China Abrasives Industry Hainan Corporation
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Full Automatic Dicing System YSL-2000AD
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... with high accuracy by using spindle’s high-speed rotation driving the cutting blade. Operation procedures Wafer or Strip Tape mounting Dicing Cleaning UV seperation Description of Auto dicing Auto-dicing system, refers to a dicing system which all...
YUSH Electronic Technology Co.,Ltd
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Sand Casting QT200 Ductile Cast Iron Dicing Saw Base Seat For Saw Machinery
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Factory Price QT200 Ductile Iron Casting Dicing Saw Base Seat Product Details Material Cast Iron and Cast Steel , ductile iron,Aluminum Producing Process Sand casting, ......
Sunrise Foundry CO.,LTD
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Double Column Automatic Vertical Band Saw / Automatic Band Saw Cutting Machine
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... variable speed 3. Saw structure varied to the material cutting requirement ,movable work table or movable saw frame , or fixed saw frame along with work table . 4. Precision guide head, blade guidance improved ,cutting noise reduced . 5. Option :...
Anhui Herrman Machinery Co.,ltd
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4000rpm 100m/Min Automatic Beam Saw Cutting Machine For Acrylic
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... to feed, especially suitable for heavy plates, and can avoid surface damage. 4. Driven by Taiwan Delta high-performance servo motor, automatic film feeding, large torque,...
Dongguan Kindlytech Technology Co.,Ltd.
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Ultra Thin Diamond Dicing Blades , Metal Bonded Dicing Saw Blade
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Resin Bonded Diamond Wheel Super Hard Tools of Hi Precision Resi Bonded Diamond Dicing Blade To grind or cut-off Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. etc Diamond wheel shape and indicates: D -- Out Diameter H -- Inner Diameter W-- ......
Shaanxi Tongyu Industry And Trade Co,.Ltd
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