25A Silicone Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue
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...Potting Compound For Electronic Components Electrical Module Low Viscosity AB Potting Glue Product description: HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber. Two-component, it cures on its own after being mixed at room temperature. Product application: 10:1 potting compound, with its convenient mix ratio, is widely used for protecting electronic......
Shenzhen Hanast New Material co.,LTD
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Waterproof High Temperature Potting Compound For Electronic Components BZ-3903
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Waterproof Electrical Potting Compound For Power Electronics Product Description BZ-3903 is a two-component addition-cure Electrical Potting Compound optimized for power electronics requiring superior waterproof sealing and environmental protection, featuring excellent fluidity, thermal conductivity (≥0.8 W/m·K), and wide temperature tolerance (-60~200℃). With a 1:1 mix ratio and balanced pot......
Guangzhou Baizhuang New Material Co., Ltd.
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White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component
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...Compound Thermally Conductive Potting Compound for Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,long working time and firere sistance.lt is especially suitable for capacitor, small electronic......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Two-component clear silicone potting compound for electronic component
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Two-component clear silicone potting compound for electronic component ∎Product Description ●SI8125A/B is used in potting protection of varied components. It can vulcanize to deep layer. The two components have a good fluidity after mixing. The ......
Shanghai Max Tech Co.,Ltd
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Grey Color Room temperature 5290 Silicone potting compound for electronic components
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● Product Features: Ø Double component, addition type. Ø Room temperature or heating curing. Ø High performance on insulation, damp proofing, vibration resistance, chemical resistance, electricleakage resistance. Ø No need to add primer coating before use......
Shanghai Huitian New Material Co., Ltd
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TIS680-12AB Gray 1.2W/MK Two Compound Thermally Conductive Potting Compound For Electronic Component
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...Compound Thermally Conductive Potting Compound For Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,long working time and fire resistance.lt is especially suitable for capacitor, small electronic......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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3M Scotch Weld DP270 Low Viscosity Epoxy Potting Compound for Electronic Components
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...Clear and Black variants. It features a 1:1 mix ratio by volume, 60-70 minute worklife at 23°C, designed for potting, sealing, and encapsulation of electronic components with negligible exotherm and non-corrosive to copper. Product Description DP270 is...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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SLF385 Silicone Waterproof Potting Compound For Electronics
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SLF385 Silicone Encapsulant Potting Compound 25KG / Drum DESCRIPTION SLF385 silicone 1 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are throughly mixed, the mixture cures to a flexible elastomer, which is well ......
GUANGZHOU BAIYUN TECHNOLOGY CO., LTD.
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Two Component Silicone RTV Gel Glue Potting Machine for Electronic Component Potting and Casting
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...component silicone RTV gel glue potting machine for electronic component potting and casting We offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric environment. Machine Picture Machine Working principle Compound......
Kapudun Automation Equipment (Guangzhou)CO.,ltd
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Heat-Resistant Waterproof Thermal Conductive Shockproof Epoxy Resin Potting Compound For Electronic Equipment
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Heat-Resistant Waterproof Thermal Conductive Shockproof Epoxy Resin Potting Compound For Electronic Equipment Product Summary: TIE®380-45 is a single-component heat-curable modified epoxy resin adhesive containing high-purity thermally conductive fillers......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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