0 5 5 0mm thermal conductive gap filler

Brand Name:ZIITEK

Model Number:TIF500BS

Place of Origin:China

Thermal Conductive Silicone Pad Aluminum Battery 5G Phone 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler TIF500BS is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal...

Brand Name:Ziitek

Model Number:TIF500BS

Place of Origin:China

Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting

Brand Name:Ziitek

Model Number:TIF100-20-11U

Place of Origin:Vietnam

... interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can ...

Brand Name:AOK

Model Number:TP-200SF

Place of Origin:China

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Product feature ■ Thermal conductivity:2.0