1 8w mk thermal filler

Brand Name:Ziitek

Model Number:TIF140-18-01US thermal pad

Place of Origin:China

...8W/mK Thermal Pad for Monitors, Power Supply & Heat Pipes, TIF140-18-01US Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal...

Brand Name:Ziitek

Model Number:TCP200-18-06A

Place of Origin:China

Light Weight white 1.8W / mK Thermal Conductive Plastic with 150℃ Heat Deflection Temperature Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in ...

Brand Name:wenyou

Model Number:LE/LH

Place of Origin:china

Product Description: One of the standout features of our casting grade epoxy resin is its low solubility, ensuring that it creates a long-lasting bond with your materials. This also means that it won't break down or degrade over time, offering excellent ...

Place of Origin:Guangdong, China

Model Number:DowCorning TC-5121C

...Thermal Grease | Single-Part 2.8W/mK Pump-Out Resistant Electronics Cooling Basic Product Properties TC-5121 C is a single-part, non-curing thermal grease with greenish-yellow viscosity. It delivers 2.8W/mK thermal conductivity, low thermal resistance (0.09℃·cm²/W), and pump-out resistance, designed for mid-to-high-end electronics thermal...

Brand Name:Ziitek

Model Number:TIF700Q Series

Place of Origin:Vietnam

TIF®700Q Factory Price Hot Selling Thermal Conductive Silicon Pad 8W/MK Silicone Thermal Gap Filling Product descriptions TlF®700Q is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating...

Brand Name:HUITIAN

Model Number:0116

Place of Origin:China

0116 TDS-EN.pdf Product Description Silicone thermally conductive compound White paste Non-curing type Product Features Thermal conductivity: 3.2 W/ m·K Solvent-free, metal powder-free for insulation requirements Very small interface thickness and very low...

Brand Name:PF

Model Number:00

Place of Origin:Guangdong,China Mainland

2.0W non silicone thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ...

Brand Name:AOK

Model Number:UTP100

Place of Origin:China

Ultra Soft Thermal Pad for for heat conduction of LED with 1.0W/m.K gap filler Attribute Value Test Method Composition Ceramic Filler, Silicone, and Reinforced Fiberglass - Color White and Brick Red Visual Thickness(mm) 0.5~12.0 ASTM D374 Density(g/cc) 2.5...

Brand Name:BOALV

Model Number:0.3-10

Place of Origin:China; USA

Special shape heat conductive material , double-sided adhesive tape. These heat conductive silicon products are applied to sink, PCBA, because of their high heat dissipating capacity and electrial isolation performance, as well as their high heat ...

Brand Name:Laird

Model Number:tputty 910

Place of Origin:China

...thermal performance of liquid gap filler. It is one-part dispensable gap filler, ready-to-use, not requiring any curing operation. Tputty™ 910 is a soft, compliant, high thermal conductivity dispensable gap filler providing lowest thermal resistance and

Brand Name:Adcol

Model Number:A-gapfill 820

Place of Origin:China

...thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. A-gaphite 800 can be supplied in 12” x 18” (305mm x 457mm) or 18” x 24”

Brand Name:Hanast

Model Number:HN-8808B

Place of Origin:Guangdong, China

Thermally Conductive Potting Compound HN-8808B - Black, 0.5 W/M·K, EMI Shielding Product Overview for Silicone Potting Compound: The HN-8808B Black Potting Compound is engineered for high-heat-density electronic devices. With a high thermal conductivity...