1mil accuracy flip chip die bonder machine

Brand Name:ASM

Model Number:NOVA Plus

Place of Origin:China

...Flip Chip Die Bonder Machine Original And Used ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder...

Categories:Electronics Production Machinery

Country/Region:china

Machine Features ● Front-loading and rear-loading methods, compatible with a docking station, facilitate operator operation and connection, improving production cycle time; ● Utilizes internationally leading dual die bonding, dual dispensing, and dual ...

Brand Name:WZ

Model Number:WZ-GX01

Place of Origin:China

.../high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Product name die bonding machine Solid crystal cycle >40 ms Die bonding position accuracy ±0.3 mil Dispensing heating constant temperature Resolution 0.5 um Chip ring size 6 ...

Brand Name:Suneast

Model Number:WBD2200

Place of Origin:Shenzhen, Guangdong Province, China

...Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. Features: Multilayer Capability System-in-Package Capability Ultrathin Die Bonding Technology Supermini Chip...