4 layer pop package substrate

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF Plate thickness: 0.15mm, Panasonic...

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

...package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,ENEPIG,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or Customize; Layer:1-6 layer

Model Number:TPAN0220F3R00K9

Product Overview The TPAN0220 is a high-power, non-inductive resistor designed for demanding industrial and automotive applications. Featuring a TO-220 package with a flange for enhanced heat dissipation, this resistor offers excellent reliability, ...

Brand Name:Rogers

Model Number:RO4360G2

Empowering Innovation with Rogers RO4360G2 High-Frequency PCBs Introduction: Redefining the realm of high-frequency circuitry, Rogers RO4360G2 laminates stand out as the epitome of cutting-edge technology, offering unmatched performance in a versatile and ...

Brand Name:PDP

Model Number:POP-014

Place of Origin:Shenzhen,China

...POP Displays , Blue Cardboard Retail Display Quick Details: 1. Substrate: SGS certified cardboard paper 2. Specification of material: 350gsm CCNB + B-flute cardboard paper 3. Material configuration: Outside facing layer is 350gsm (gram per square meter) CCNB/coated clay news back paper, on which graphics are printed; Core/middle layer(s) is 140gsm strength-supportive corrugated paper; Lining layer...

Brand Name:HUAXING

Model Number:Frozen Food Packaging

Place of Origin:GUANGDONG, CHINA

Multi-Layer Popsicle Packaging Pouch Product Overview A Multi-Layer Popsicle Packaging Pouch is a specialized high-barrier flexible package designed for the unique challenges of popsicle and ice pop preservation. Engineered with multiple laminated polymer ...

Place of Origin:China

Brand Name:Jiaqing Circuit

...substrate is specifically engineered for high-frequency 5G RF modules, Antenna-in-Package (AiP), and millimeter-wave communication applications. Modified BT resin systems achieve dissipation factor (Df) as low as 0.005 @ 28 GHz through spherical silica-filled formulations. These substrates support 14-layer any-layer...

Brand Name:T&W

Place of Origin:China(Mainland)

...+One PMS color offset printing Final finish: Glossy/Matt lamination Accessory: Price: Depends on qty,size,printing,package etc Packaging Details: In flat, as per customer’s requirement, or pre-fill with products before shipping or

Brand Name:Xingqiang

Model Number:As Per Customer's Model

... substrates support critical signal routing, thermal dissipation, and mechanical stability for advanced semiconductor applications. Our team tailors layer structures, line widths, pad layouts, and array formats to match your specific chip requirements,

Place of Origin:China

...ch makes it ideal for use in optics and other applications where transparency is important. The Sapphire Substrate comes in a package of 25/cassette, making it easy to handle and store. The substrate features a sapphire template layer and is oriented along

Model Number:Customized

Brand Name:8Printing

Place of Origin:China

...Pop Up Greeting Card And Inner Sub Boxes Product Features Book-Style Rigid Architecture: Premium book-shaped packaging design featuring a secure flip-top structure that opens like a storytelling keepsake. Integrated 3D Pop-Up Mechanics: Complex multi-layer...

Brand Name:Customized

Place of Origin:China

Product features: This rigid circuit board is used Ceramic substrate lamination WL-CT338.The ceramic substrate material is widely used in electronic packaging substrate for its advantages such as high strength, good insulation, good thermal conductivity...

Model Number:RS202504028001

Place of Origin:CHINA,GUANGDONG

... packaging adopts vacuum forming technology, including a three-layer design. The inner middle tray provides a secure storage space for your baseball cap, ensuring its shape and quality. The bottom adopts a vacuum ...

Brand Name:Geertop

Model Number:6 Person Large Family Tent

Place of Origin:Dongguan,China

Large Family 6 Person Portable Double Layer Camping Tent For Fishing Camping Outdoor Activities Specification: Inner Tent: 190T breathable polyester Tent Rainfly: 210T PU2500MM waterproof polyester, seam tape Tent Floor: 150D waterproof coating PU3000MM ...

Brand Name:Upass

Model Number:Polyethylene Packaging Film

Place of Origin:China

...Packaging Film For Emulsion Explosive Packaging Product Description: It is a high-strength multi-layer composite film,It is made of HDPE as the base material, adding plasticizer, plasticizer, stabilizer, antioxidant, UV absorber, toughener and other additives through multi-layer co-extrusion blow molding into embryos, and then by multiple pull Stretching, then rotary cutting into a film substrate...

Brand Name:QuanJiang

Model Number:MR,SPCC tinplate

Place of Origin:China

... of tin plated on the surface of a low-carbon steel substrate by electroplating. It is mainly composed of a steel substrate, a tin layer and an alloy layer between the two. 2,Manufacturing process: It includes pickling, cold rolling, electrolytic cleaning,

Brand Name:JOYWAY

Model Number:POP2025

Place of Origin:China

... the compressive strength of the product. Used in furniture cushions, mattresses, sound-absorbing panels, carpet lower layer, filters, packaging materials, etc. Technical data: Property Value Unit of measurement Method Hydroxyl number 35.0-39.0 mg KOH/g

Place of Origin:China

Brand Name:CUSTOM MADE

...Substrate PCB Layout Design Producibility Multi-Layer Boards Rogers PCB Layout Design Description: 1. High-Speed PCB Design 2. 40G / 100G System Design 3. Mixed Digital PCB Design 4. SI/PI EMC Simulation Design PCB Layout Design Parameters: SMT Capability 14 million spots per day SMT Lines 12 SMT lines Reject Rate R&C: 0.3% IC: 0% PCB Board POP...