5cefa7f27i7n fbga 67

Brand Name:Original Factory

Model Number:5CEFA7F27I7N

Place of Origin:China

5CEFA7F27I7N FBGA-67 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to ...

Brand Name:Original Factory

Model Number:THGBMNG5D1LBAIL

Place of Origin:CN

THGBMNG5D1LBAIL Memory IC Chip 4 GB eMMC Memory IC FBGA-153 Package Product Description Of THGBMNG5D1LBAIL THGBMNG5D1LBAIL is 4 GB eMMC Memory IC,the package is FBGA-153. Specifications Of THGBMNG5D1LBAIL Package/Case: FBGA-153 Memory Size: 4 GB Minimum ...

Brand Name:Hiner-pack

Model Number:HN21002

Place of Origin:Made In China

Customized JEDEC Matrix Trays Loading FBGA IC ESD Rohs Raw Material Protect your ICs from electrostatic discharge and mechanical stress with JEDEC-compatible trays built for cleanroom and factory use. Hiner-pack offers the ultimate protection and ...

Brand Name:Intel/Altera

Model Number:EP3C55F484I7N

Place of Origin:original

EP3C55F484I7N EP3C55F484I7N FBGA-484 Electronic Components Integrated Circuit IC To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided. We attach great importance to ...

Brand Name:ICMAX

Model Number:IMD256M16R4ABD8LY

Place of Origin:CN

DDR4 4Gb SDRAM Memory Chip Refresh IMD256M16R4ABD8LY DDR4 SDRAM IMD256M16R4ABD8LY – 32 Meg x 16 x 8 Banks Features VDD = VDDQ = 1.2V ±60mV VPP = 2.5V, –125mV/+250mV On-die, internal, adjustable VREFDQ generation 1.2V pseudo open-drain I/O TC of 0°C to 85...

Model Number:XQ2VP40-5FG676

We can supply XQ2VP40-5FG676N , send us a request quote to request XQ2VP40-5FG676N pirce and lead time.https://www.henkochips.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in ...

Brand Name:XILINX / AMD

Model Number:XC3S700AN-4FGG484I

Place of Origin:Multi-origin

Xilinx XC3S700AN-4FGG484I Programmable IC Chip Product Features: - Xilinx Spartan-3E FPGA - 700K system gates - 4.2Mbits of embedded RAM - 2.5V to 3.3V core voltage - 1.2V to 3.3V I/O voltage - 484-pin FBGA package - Low power consumption - High speed ...

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm...

Brand Name:KIOXIA

Model Number:THGBMHT0C8LBAIG THGAMRT0T43BAIR THGJFCT0T44BAIL THGJFCT0T44BAKL THGAF8T0T43BAIR THGAFBT0T43BAB8 THGAFET0T43BAB8 THGAF4T0N8LBAIR

Place of Origin:TAIWAN

THGJFCT0T44BAIL KIOXIA NAND FLASH - 128 Gbyte UFS3.1 BiCS Manufacturer:Kioxia Product Category:UFS RoHS: Details Series:THGJF Memory Size:128 Gbyte Configuration:BiCS Operating Supply Voltage:2.7 V to 3.6 V Minimum Operating Temperature:- 25 C Maximum ...

Brand Name:Intel

Model Number:EP4CE40F23C8N

EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone® IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Voltage - Supply 1.15V ~ 1.25V Mounting Type ...