chip scale packages ic die carriers

Brand Name:Hiner-pack

Model Number:HN24008

.... These trays feature a series of separator ribs arranged in a regular pattern, creating pockets that give the trays a resemblance to a waffle. Waffle pack chip trays are mainly employed for the handling and transportation of

Brand Name:TI

Model Number:TPS63036YFGR

Place of Origin:original

TPS63036YFGR Power Management ICs High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package 8-UFBGA Product Status Active Function Step-Up/Step-Down Output Configuration Positive Topology Buck-Boost Output Type ...

Brand Name:Jiaqing Circuit

Place of Origin:China

...IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate redistributes fine-pitch die

Brand Name:ACE DELIXIN

Place of Origin:Shenzhen, China

Model Number:Customizable

...Carrier Tape for IC Module Packaging High precision carrier tape is suitable for IC modules, chips and small electronic components that require accurate positioning. The custom pocket structure helps hold each component firmly and reduces the risk of misalignment during transportation or machine feeding. It is ideal for customers who need stable quality and customized packaging...

Brand Name:zmkj

Model Number:12inch 300mm single wafer container box

Place of Origin:CHINA

...Carrier Container Box Silicon Sapphire Box for 300mm semiconductor wafer shipping 2inch/3inch/4inch/6inch/8inch single wafer container box Waterproof 12 Inch Single Wafer Carrier Box Environmental Friendly Our company provides 1-inch, 2 inch, 2.5 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch single-chip silicon box, single-chip wafer box, single-chip silicon box, IC tray chip packaging...

Brand Name:Original Factory

Model Number:K4B4G1646E-BYMA

Place of Origin:CN

...comes in a 96 FBGA package. The speed of K4B4G1646E-BYMA is 1866 Mbps, and it operates at a voltage of 1.35 V. The temperature range for its operation is 0 ~ 85 °C. Specifications Of K4B4G1646E-BYMA Density:4 Gb Package:FBGA-96 Speed:1866 Mbps Voltage:1

Brand Name:TI

Model Number:SN75240PWR

Place of Origin:Original

FEATURES ►Design to Protect Submicron 3-V or 5-V Circuits from Noise Transients ►Port ESD Protection Capability Exceeds: − 15-kV Human Body Model − 2-kV Machine Model ►Available in a WCSP Chip-Scale Package ►Stand-Off Voltage ... 6 V Min ►Low Current ...

Brand Name:YAOAN

Model Number:45MM

Place of Origin:CHINA

...Carrier Tape Forming Machine Applications: Carrier Tape apply to the IC, SMT semiconductors,crystal and other chip components of the SMD tape packaging. Piezoelectric crystal industry specifications:49U/SMD,49S/SMD,UM-1/SMD,UM-5/SMD,SMU7,SMU5,osc half 8045,7050,6035,5.32,4023,3225 and other SMT. Technology Peatures Carrier...

Place of Origin:Original

MT29F16G08ABABAM62B3WC1 Specifications Part Status Obsolete Memory Format FLASH Memory Type Non-Volatile Memory Size 16Gb (2G x 8) Speed - Interface Parallel Voltage - Supply 2.7 V ~ 3.6 V Operating Temperature 0°C ~ 70°C (TA) Package / Case Die Supplier ...

Brand Name:Microchip Technology

Place of Origin:China, GuangDong, ShenZhen

...applications. These IC Chips are programmable and are available in various packages such as DIP, SOP, QFP, QFN and BGA, making them suitable for industrial, automotive and consumer electronics applications. Electronic IC Chips also come in a variety of

Brand Name:ZMSH

Model Number:Chip loading shipping box

Place of Origin:CHINA

...Chip loading transport box Chip loading transport box chiplets packaging box Self-absorbing plastic box Chip boxes (IC chip storage boxes) are specialized vehicles for the secure storage, transportation and automated sorting of semiconductor chips (dies) or packaged IC devices, typically made of antistatic engineering plastics (such as PC, ABS, PPS) or conductive composites. Its core function is to protect the chip...

Brand Name:GKG

Model Number:GD602D

Place of Origin:China

... with dual swing arms for 180° cross-bonding. 2. Compatible with a printer to enable a variety of in-line process solutions. 3. Fully integrated carrier from loading, printing, to die bonding and

Brand Name:Suneast

Model Number:CBD2200 EVO

Place of Origin:Shenzhen, Guangdong Province, China

Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types...

Brand Name:FZX Fan-Out Panel Level Packaging

Model Number:Face up-wafer bump

Place of Origin:PR China

...Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surface treanment and laser cutting will be performed. The process is simple and has the advantage of low cost. Competitive Advantage: Using the bump of chip

Model Number:8468-21B1-RK-TR

Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible wit...

Brand Name:Original

Model Number:NRF51422

Place of Origin:Norway

... sensors Descriptions: NEW ENHANCEMENTS - include variants with 32kB RAM for improved application performance, and 128kB flash wafer level chip scale package (WLCSP)

Brand Name:METS

Place of Origin:XIAMEN.CHINA

...die for parts IC lead frame / led lead frame / copper lead frame SIP-14L Lead frames are the metal structures inside a chip package that carry signals from the die to the outside. Leadframe for a QFP package The die inside the package is typically glued to the lead frame, and then bond wires attach the die...

Brand Name:Original Factory

Model Number:XC7K410T-2FB900I

Place of Origin:China

IC COMPONENTS XC7K410T-2FB900I In Stock Original Brand New FPGA IC Chip Product Description Cost-optimized for system I/O expansion Scalable optimized architecture, comprehensive tools and IP reuse Machine vision interfacing Product Specifications Part Number: XC7K410T-2FB900I Serial Bandwidth: 800 Gb/s PCIe Interface: X8 Gen2 RAM: 36 Kb Dual-port Block Core Voltage: 1.0V AES: 256-bit Package Options: Bare-Die Flip-Chip...

Brand Name:Anterwell

Model Number:SN74HC374N

Place of Origin:original factory

SN54HC374, SN74HC374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS • Eight D-Type Flip-Flops in a Single Package • High-Current 3-State True Outputs Can Drive up to 15 LSTTL Loads • Full Parallel Access for Loading • Package Options Include ...