diamond wafer n content

Brand Name:Infi

Model Number:JSBD

Place of Origin:Hunan, China

...Diamond Wafer Cvd Substrate To Reactor CVD Optical Diamond Product description: CVD diamond wafer cvd Substrate to reactor CVD Optical diamond diamond plate industry cvd diamond Size of CVD diamond plates: 1*1*1mm , 2*2*1mm , 3*3*1mm , 4*4*1mm , 5*5*1mm , 6*6*1mm, 7*7*1mm , 8*8*1mm ,9*9*1mm ,10*10*1mm ,11*11*1mm , 12*12*1mm 13*13*1mm 14*14*1mm 15*15*1mm 16*16*1mm20*20*mm Product name: CVD Substrate to reactor CVD Optical diamond

Brand Name:Infi

Model Number:JSBD

Place of Origin:Hunan, China

...Diamond Wafer Cvd Substrate To Reactor CVD Optical Diamond Product description: CVD diamond wafer cvd Substrate to reactor CVD Optical diamond diamond plate industry cvd diamond Size of CVD diamond plates: 1*1*1mm , 2*2*1mm , 3*3*1mm , 4*4*1mm , 5*5*1mm , 6*6*1mm, 7*7*1mm , 8*8*1mm ,9*9*1mm ,10*10*1mm ,11*11*1mm , 12*12*1mm 13*13*1mm 14*14*1mm 15*15*1mm 16*16*1mm20*20*mm Product name: CVD Substrate to reactor CVD Optical diamond

Brand Name:zmkj

Model Number:AlN Template on Diamond

Place of Origin:CHINA

AlN on Diamond template wafers AlN epitaxial films on Diamond substrate AlN on Sapphire /AlN-on-SiC/ AlN-ON Silicon Welcome to Know AlN Template on Diamond~~ Advantages of AlN • Direct band gap, band gap width of 6.2eV, is an important deep ultraviolet...

Brand Name:HT

Model Number:HT-WSB

Place of Origin:China

... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools,

Brand Name:Worldia

Model Number:Customized

Place of Origin:Beijing, China

...hardness CVD diamond wafer CVD insert for machining cutters As a core business of Worlida subsidiary, Sunpower supplies laser cutting services and the raw material of cutting grade Diamonds, The high thermal conductivity of cutting grade diamonds make it ...

Brand Name:Trojan

Model Number:DP, DR, DM

Place of Origin:China

Diamond Cut-off Wheel/ Diamond Wafering Blades Product Description CUTTING/ SECTIONING Cutting is the first step in a complete material analysis, the selection of cutting ma-chine and blades must match geometry and material properties of sample. TROJAN ...

Brand Name:YUDA CRYSTAL

Model Number:YD001

Place of Origin:China

Product Description: Are you in search of high-quality lab-created loose diamonds for your jewelry designs? Look no further than our exquisite collection of loose lab-grown diamonds, available in a range of sizes and shapes to suit your needs. Our lab-...

Brand Name:ZMSH

Model Number:diamond substrate

Place of Origin:CHINA

customzied size MPCVD method GaN&Diamond Heat Sink wafers for Thermal management area MPCVD method polytype Diamond substrate wafers for GaN epitaxial Diamond has wide band gap, high thermal conductivity, high breakdown field strength, high carrier ...

Brand Name:TY

Model Number:RTM-TCD-018

Place of Origin:CHINA

...Diamond Grinding Wheels Large Segments Special For Concrete Cements And Stone Polishing Diamond Grinding Wheel / Diamond Polishing Wheel Diamond Grinding Wafer / Diamond Polishing Wafer Large Segments Grinding Blocks Blade Type: RTM-TCD-018 Image Sample Specification: 80*20mm / 150*22.23mm (Diameter x Hole) , Bowl Shape Processing Applications of Diamond Polishing Wafer...

Brand Name:SIGNI

Model Number:SS

Place of Origin:CN

Diamond Back Grinding Wheel for Silicon Sapphire Wafers cut glass dremel diamond wheel Product Description Name Diamond Back Grinding Wheel for Silicon Sapphire Wafers cut glass dremel diamond wheel Bond Vitrified bond HS Code 8202390000 Products Range 1. Synthetic diamond powder /natural diamond powder 2. Electroplated diamond grinding wheel /electroplated saw blade/ electroplated diamond disc 3. Resin bond diamond...

Brand Name:CAEC

Place of Origin:China

Diamond Slurry 500ml 5L Water Based Diamond Slurry For LED Substrate SiC Wafer Diamond slurry is widely used for polishing and lapping a variety of materials, such as LED substrate, SiC wafer, IC chip, fine ceramic, optical glass, gem, metal and cemented ...

Brand Name:BonTek

Model Number:Fused Silica, Fused Quartz

Place of Origin:China

...Wafer JGS3 C7979 and SK1310 with Very Low OH content There are also IR grade Fused Silica wafers with transmission from 185nm to 350nm. The IR grade fused silica is usually with very low OH content (i.e., <5ppm), the melting method electrical melting. The brand/grade for this type is JGS3, Corning 7979 and SK1310. BonTek supply these wafers...

Brand Name:HUATAO

Model Number:Ultra-Thin Diamond Wire

Place of Origin:CHINA

... diamond wire is a cutting-edge cutting tool used in the semiconductor and photovoltaic (PV) industries for slicing silicon wafers with exceptional accuracy and minimal material loss. It consists of a high-tensile core wire (typically steel or tungsten)

Brand Name:ZG

Model Number:MS

Place of Origin:CHINA

Backgrinding Wheels Backgrinding Wheels, are mainly used for the thinning and fine grinding of the silicon wafer Our diamond wheels offer durability and accuracy by employing the most advanced engineering techniques and precision processing for back grind...

Brand Name:ZZDM

Model Number:φ55mm

Place of Origin:China

...toughness and wear resistance ● good electro-discharge machinability and grindability ● machining of low-medium content silicon aluminium alloys ● good choice for wood composites, chipboard, plastics and non-ferrous materials ● also used where the

Brand Name:JC

Model Number:JC-004

Place of Origin:CHINA

Cylindrical D100 D120 Diamond Finishing Burs For Low Iron Content Metals The use of diamond grinding heads is becoming more and more obvious. It is widely used in low iron content metals and non-metallic hard and brittle materials that are difficult to be ...

Brand Name:Shine Abrasives

Model Number:4V2 1A1 14A2

Place of Origin:China

Metal Bond Diamond Grinding Wheel for Silicon Sapphire Wafer Edge Grinding Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of sillicon wafers, which requires uniform sharpness in addition to precision accuracy...

Brand Name:PAM-XIAMEN

Place of Origin:China

Product Description Float-Zone Silicon Wafer With High-Resistivity And Good Lifetime. FZ-Silicon The mono-crystalline silicon with the characteristics of low foreign-material content, low defect density and perfect crystal structure is produced with the ...

Brand Name:YSD

Place of Origin:Zhejiang, China

Model Number:Pad

... Grinding stage need sufficient cooling water,but a little water needed to the polishing stage,finally using BUFF polished wafer to achieve a better light effect. 3. The best speed of the water mill is 4500r/min,the maximum line speed is 22.5m/s.,we can