Dip29 Mgp Mold

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Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

Brand Name:TJIN

Place of Origin:China

DIP29 MGP Mold Main packaging form To series: T0220/263/247/252/3p, etc.; SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;; DIP series: DIP4/8/14/16/18/23/24/25/29/40; SOT series: SOT23/25/26/223/89;; SOD series: S0D123/323/523/723/923; QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc.; QFP/IPM series; Semiconductor device/chip/IC plastic seal. Product Description: MGP Mold - High-Precision and High-Quality Chip Packaging Solution MGP Mold...

Guangdong Taijin Semiconductor Technology Co., Ltd

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Guangdong

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