high precision semiconductor bonding system

Brand Name:OEM

Model Number:3A1

Place of Origin:China

... hard and brittle alloy,non-metal materials. Such as hard alloy, ceramics, agate, optical glass, semiconductor materials and wear-resistant cast iron, stone, spring steel, tool steel, bearing steel, etc. Bond Material Resin etc. Blade Color Natural or

Brand Name:Suneast

Model Number:WBD2200 PLUS

Place of Origin:Shenzhen, Guangdong Province, China

...High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die bonding technology Bottom photo-taking, high precision...

Place of Origin:Guangdong, China

Brand Name:YUSH

...High-precision thermal bonding equipment designed for precision soldering applications requiring controlled thermal management. Technology Overview Hot bar soldering is highly effective for bonding dissimilar components that are difficult to unite using traditional methods. This pulse bonding...

Model Number:618SH

Place of Origin:China

Brand Name:CHUANGLIYOU

...Bonding Machine TV LCD Panel for Cof/Tab Bonding Replacement LCD TV Panel Bonding Machine Description This equipment is suitable for a variety of FPC / COF / TAB and LCD or PCB board combination bonding. It is a professional high precision repair equipment for reparing 2K, 4K and curved screen different sizes of LCD screen cable damage or natural fall off. LCD TV Panel Bonding Machine Features Heat cure Fast bonding time High

Brand Name:HOSON

Model Number:GTS80AH-I

Place of Origin:China

Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder Die Bonding Machine Strip Die Bonder-Dual Dispensing Machine Features ● Front-loading and rear-loading methods, compatible with a docking station, facilitate operator ...

Place of Origin:Zhuzhou

Brand Name:Hong Yang / OEM

Model Number:Steel Bonded Titanium Carbide GT35 Guide Roller - 05

... after quenching and tempering), high wear resistance, high impact resistance and good hardenability; The product is dispersed in a large number of refractory metal carbide (titanium carbide), greatly improving the ...

Brand Name:HUATEC

Model Number:HFD-810

Place of Origin:China

...High Precision Ultrasonic Bond Tester with B-scan Imaging Bluetooth PDF Report Features:  Key parameters tested for the waterproof layer: thickness and adhesion.  Supports full testing procedures; easy to operate, enabling waterproof layer inspection right after startup.  Assisted inspection with B-scan imaging.  Repetition rate: 16–15000 Hz adjustable with high precision; high-speed scanning ensures no defects are missed.  High

Brand Name:ZHMACH

Model Number:ZHFH-1650/2150

Place of Origin:Guangdong China (Mainland)

High Precision Coil Stock Measure Machine To Measuring length For Roll Sponge To measure a variety of fabrics,including foam,cloth The primary purpose is to measure a variety of fabrics,including foam,cloth and pack them into finished product. model QHFH-...

Brand Name:Large-auto

Place of Origin:China

Inline High-Speed Glue Spraying Machine--Dispensing equipmen designed to deliver high precision filling bonding and encapsulation in electronics manufacturing processes Product Features: High-speed linear motor drive control further improves production ...

Brand Name:CSIMC

Model Number:Fused Silica, Fused Quartz

Place of Origin:China

... applications. Crafted from the purest fused silica, our wafers offer unparalleled optical clarity, thermal stability, and chemical resistance. Designed for precision and durability, our Wafer-Grade Fused Silica Wafers are the perfect platform for

Brand Name:HKAA

Place of Origin:China

... Item CNC Machined Wafer Processing Equipment Housing | High Precision Semiconductor Structural Parts Materials Aluminum,Stainless Steel,Titanium,Barss,Copper,Plastic,Alloy Custom material Precision Tolerance ±0.001mm~±0.005mm Surface Roughness Min Ra...

Brand Name:TJIN

Place of Origin:China

...cutting mold molds, chip cutting mold mold molds, semiconductor gluten molding molds, etc., use the upper and lower molds of the gluten, and all are used. It is necessary to customize, advanced technology, use imported raw materials, have high accuracy of

Place of Origin:China

Resin Bond Wheels For Tool & Cutter Resin bond wheels has free cutting, self-sharpening, good rigidity and strength, less heat and jam generated in grinding, easy control of the precision and easy dressing such characteristics. Application: Different from ...

Brand Name:SMTfly

Model Number:SMTfly-PP1A

Place of Origin:China

Hot Bar Soldering Machine-FPC Precision Hot Bar Bonding Machine,SMTfly-PP1A Specifications: Working area (mm) 200 × 260 Working pressure (pa) 0.6-0.8 Working environment 10-60 ℃, 40% -95% Hot pressing time (S) 1 ~ 99.9 Positioning fixture 1 Temperature ...

Brand Name:EcooGraphix

Model Number:DX2800

Place of Origin:China

Product Description DX4800, DX2800 and DX1800 are high precision laser imagesetter after a long time of practical application, proved that this type of machine performance is reliable and stable, simple operation. The full imagesetter includes CTF machine...

Model Number:M80-2530045

... for semiconductor manufacturing, ensuring high-quality control and defect detection. Its innovative design and precise measurement tools make it ideal for critical stages of chip production.Product Attributes Brand: OptiPro Origin: USA Material: High-...

Brand Name:MEAXPERT

Model Number:Carina

Place of Origin:China

Product Description Coordinate Measuring Machines (CMM) MXP coordinate measuring machines provide the precise and fast measurements you need for quality assurance. Our coordinate measuring machines (CMMs) offer precise 3D measurements for both contact and ...

Place of Origin:China

Brand Name:ZMSH

...precision-engineered substrates designed to provide reliable mechanical support for wafers, semiconductor dies, and panels during advanced manufacturing and packaging processes. Fabricated from single-crystal sapphire (Al₂O₃), these carriers combine high stiffness, exceptional hardness, optical transparency, and excellent dimensional stability to meet the demanding requirements of precision

Brand Name:CAEC

Place of Origin:Henan, China

...Bond Dicing Blades Product overview Resin bond dicing blades without steel core is mainly used for precision cutting and slotting for semiconductor, optical glass, quartz glass,ceramics and so on. Main features Sharpness cutting and elastic bond can improve the surface quality. High precision, less dressing or no need to dress. Widely used, variety specifications, short delivery time. Application ZS001 series is suitable for semiconductor