how to remove bga chip

Brand Name:Wisdomshow BGA

Place of Origin:China

...remove ic chip from iphone Automatic removing and mounting eballing machine for video game consoles Product Describable Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main user is repairing shops and factory to provide the after-sales service and rework. Repair steps: 1) Separate the BGA chip...

Place of Origin:Guangdong, China

Brand Name:WISDOMSHOW

...Bga Chip Rework Machinery Motherboard Repairing Equipment WDS-1250 Product Description Application 1.All mobile phone ic chip repair such as iPhone serious, Samsung, Huawei, etc; 2.PC, tablet, notebook, desktop, laptop motherboard bga rework and repair; 3.Game consoles applications such as Xbox360, PS2, PS3, PS4 Wii bga rework and repair; 4.Large circuit board maintenance, such TV, LED, service; 5.Almost all PCB board ic removal...

Place of Origin:Guangdong, China

Brand Name:YUSH

...solder and solder all types of BGA components (lead-free and leaded) Remove and repair motherboard BGA IC chips and other components Reduce production costs by reworking defective solder joints during PCB assembly Rework micro BGA, VGA, CCGA, QFN, CSP,

Place of Origin:shenzhen

Brand Name:wisdomshow

Model Number:wds 650

***Wisdomshow in line with reasonable prices,excellent quality and sincere service to you*** How to contact us Our Aim: Quality, Service, Guarantee! Welcome to visite our company ! ....

Brand Name:FASTPCBA

Model Number:PCB Assembly

Place of Origin:China

... tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days service Max size of finish board 700*460mm File

Brand Name:FASTPCBA

Model Number:PCB Assembly

Place of Origin:China

... tin,OSP… Components Passives down to 0201 size BGA and VF BGA Leadless Chip Carriers /CSP Double -sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and replacement-Same days service Max size of finish board 700*460mm File

Brand Name:HUASWIN

Model Number:HSPCBA1021

Place of Origin:China

... and Thru-hole 2 Solder Type Water Soluble Solder Paste,Leaded and Lead-Free 3 Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carries/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Part Removal and Replacement