hydrophilic wafer bonding equipment

Brand Name:ZMSH

Model Number:Wafer Bonding Equipment

Place of Origin:CHINA

Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding Equipment is a high-end bonding equipment specifically designed for silicon carbide (SiC) power device manufacturing, supporting 2 to 12-inch wafer specifications. Wafer Bonding Equipment incorporates advanced room-temperature direct bonding and surface-activated bonding...

Brand Name:ZMSH

Model Number:Wafer bonder equipment

Place of Origin:China

...silicon carbide (SiC) wafers, supporting both room temperature bonding and hydrophilic bonding techniques. It is capable of handling wafers of 4-inch, 6-inch, 8-inch, and 12-inch sizes, and is optimized for SiC-to-Si and SiC-to-SiC bonding applications.

Brand Name:RAYSON

Model Number:RS-A123

Place of Origin:GUANGDONG, CHINA

Soft feeling and hydrophilic spun bonded pp non woven cloth for hygienic products Quick Detail: Material 100% Virgin Polypropylene Nonwoven Technics Spun-Bonded Pattern Embossed/Seasame Width 5-320cm/ 2”--126” Weight 10-150gsm MOQ 1500Kilograms Color ...

Brand Name:STARLAND

Place of Origin:China

Model Number:MW SERIES

...Gas Monaka Wafer Production Equipment For Consistent Production Needs Product Description: The Automatic Monaka Wafer Production Line is a cutting-edge solution for producing delicious wafer biscuit, making it an essential piece of equipment for snack food...

Brand Name:Bird UV

Model Number:BTW200

Place of Origin:Guangdong, China

...wafer oven UV LED wafer debonder machine wafer debonding Adhesive Peeling dessolver equipment Type: UV Lamp Light Power Intensity: 1-20W/cm2 Weight: 10 KG Power: 550w Warranty: 1 Year Cooling Method: Air Cooling Wavelength: 365nm Size: 366*158*360mm/customized Control Method: ON/OFF,PLC Selling Units: Single Item Product Application UV Printing,UV Glue,UV Adhesive,UV Bonding...

Brand Name:PAM-XIAMEN

Place of Origin:China

... and industry manufacturers. We has developed SiC crystal growth technology and SiC crystal wafer processing technology,established a production line to manufacturer SiCsubstrate,Which is applied in GaNepitaxydevice,powerdevices,high-temperature device and

Place of Origin:CHINA

Brand Name:SKYWIN

High Quality Automatic Wafer Making Machine / Wafer Line / Wafer Biscuit Making Machine Product Description Skywin is Professional Manufacturer specilized in Wafer machine,Wafer biscuit production line. It is full automatic control whole line. Our factory...

Brand Name:Gonghexiang

Model Number:SD80-61A

Place of Origin:China

PLC Control Cone Ice Cream Machine , Sugar Cone Wafer Processing Equipment Cone Ice Cream Machine Introduction Tunnel-type full automatic sugar cone making machine is a kind of machine which controlled by PLD,with complete automatization ,high capacity...

Brand Name:HengChao

Model Number:HC-MFQ-02

Place of Origin:Guangzhou, China

...Bonding Equipment For Lunch Box Or Thermal Cup Seal O Ring Material Production Product Description: The O Ring Bonding Machine is a highly efficient production machine designed for the automatic cutting and bonding of all O-rings. It has a cycle of operation of 12-15 seconds per piece, and can be customized to meet various weight requirements. It is also known as a Butyronitrile Ring Making Machine, Rubber ring bonding...

Brand Name:Jzc

Model Number:Jzc-zjt01

Place of Origin:Suzhou China

Suction Connecting Pipe Automatic Bonding Equipment, Pipe Length Can Be Customized Equipment function: Automatic gluing and bonding equipment for 1.7-1.5m connecting pipes. The equipment is directly connected to the extruder, and the manipulator ...

Brand Name:XINTING

Model Number:XT105

Place of Origin:CHINA

EPE Foaming Sheet Pipe Bonding Machine EPE foam rod/pipe/tube extrusion machine EPE Foaming Sheet Pipe Bonding Machine is used to stick both pe foam sheet together by electric heating or frame heating there are two types depending on the working style: I. ...

Brand Name:RPS-SONIC

Model Number:RPS-WH-100

Place of Origin:China

Ultrasonic Photoresist Coating Spray Gun for Silicon Wafers Painting Equipment What is the ultrasonic spray nozzle? An ultrasonic glue spray coating machine is a specialized device designed to apply adhesive coatings using ...

Model Number:616dh

Place of Origin:China

Brand Name:CHUANGLIYOU

Acf / Cof Bonding Machine Pulse Hot Press Equipment to Repair LCD TV Screen What LCD Panel Problems our TAB Bonding Machine can solve out? you will find answers in the below: Screen failure: Vertical, horizontal, vertical, horizontal, black belt, the black...

Brand Name:QRsonic

Model Number:FSWD-DS400

Place of Origin:China

... method commonly used in plastic product processing and production. The DS400 series is also equipped with a new generation of digital ultrasonic generators; The entire series is equipped with a 4.3-inch internal touch screen as standard, which is used in

Brand Name:Dongho

Model Number:TH-M2048

Place of Origin:China

20kHz 4800W Ultrasonic Metal Bonding Equipment For Metal Terminal Welding Technical Parameters: Product Name Ultrasonic Metal Bonding Equipment Model TH-M Frequency 20KHz Power Range <=4800W Welding Force 1200 Newton Max. Control Voltage 24V ...

Brand Name:ZT

Model Number:ZT-DHJ030

Place of Origin:China

Semi Automatic Tin Soldering Machine smt bonding equipment soldering machine 1. Operational Mechanism: Manual- Automatic Hybrid - Semi-Automated Solder Feeding The machine automatically dispenses solder wire via a motor-driven feeder, triggered by a foot ...

Brand Name:TJIN

Place of Origin:China

Semiconductor Automatic Slicing Machine Features: Chip Sorting Machine Product Name: Chip Sorting Machine Power Consumption: 2.5kW Sorting Speed: Up To 500 Chips Per Minute Air Consumption: 0.1m³/min Sorting Method: Optical Sorting Air Pressure: 0.6-0.8MPa...

Place of Origin:Jiangsu, China

Brand Name:GAOQI

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Brand Name:WZ

Model Number:WZ-GX01

Place of Origin:China

...Equipment/led/high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Suitable for: SMD HIGH-POWER COB,part COM in-line package etc. 1,Full automatic up load and down load materials. 2,Module design,max optimization structure. 3,Full intellectual property right. 4,Picking die and Bonding die dual PR system. 5,Multi-wafer ring,dual glue ect configuration. Wafer Stage System The wafer...

Brand Name:Suneast

Model Number:WBD2200 PLUS

Place of Origin:Shenzhen, Guangdong Province, China

...Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die bonding...