v 0 thermally conductive epoxy potting compound

Brand Name:Hanast

Model Number:HN-5508A/B

Place of Origin:CHINA

5:1 Electronic Epoxy Potting Glue Waterproof Sealing Insulation For Power Module Circuit Board Electrical Sealant for Transformers Resistors Filters Electronic Appliances HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy ...

Place of Origin:China

...Dosing System 2 Component Ab Mixing Dispensing Machine Thermally Conductive Epoxy Silicone Compound Potting Machine Potting is a method for processing resins based on silicone, polyurethane or epoxy in liquid form to cover electrical components such as ...

Brand Name:Maxtech

Model Number:Ep3115(2#)

Place of Origin:China

We Supply Free Samples. OEM & ODM are Welcomed. we can do your logo and Brand Two-component solventless room temperature curing epoxy potting-sealing material Compound Specification T Test items Test criteria Units EP 3115(2#) A EP 3115(2#) B Color Eye ...

Brand Name:Ziitek

Model Number:TIE380-25

Place of Origin:Vietnam

...Thermal Conductive 1.5W/Mk Epoxy Resin Potting Compound Thermal Conductive Epoxy Glue Product Summary: TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength. TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure. Feature > Good thermal conductivity...

Brand Name:Ziitek

Model Number:TIE280-12AB

Place of Origin:China

... epoxy encapsulant compound. lt is design for potting of capacitors and electricaldevices. TIE280-12AB-Series-Datasheet (2).pdf Feature > Good thermal conductive: 1.2W/mK > Excellent insulation and smoothly sourface. > Low shrinkage > Low viscosity ,

Brand Name:Ziitek

Model Number:TIE™380-25

Place of Origin:China

...Thermal Conductivity Epoxy Glue for electronic potting compound Product Summary: TIETM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity and bond strength. TIETM380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure. Spec-of-TIE380-25.pdf Feature > Outstanding thermal...

Brand Name:Aorun

Model Number:Aorun 1477

Place of Origin:China

...Thermal Glue Potting Compounds Pouring Sealant For Potting Electronic Quick Detail: Name Epoxy Resin 1477 Usage Construction, Fiber & Garment, Footwear & Leather, LED Mixing Ratio A: B =1:1 (By weight) Applications Epoxy floor coatings,Electronic component potting epoxy compound Description: silicone systems. Our products show excellent electrical conductivity, high adhesion strength, thermal...