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| Categories | Grinding Wheel For Semiconductor And Photoelectricity |
|---|---|
| MOQ: | 1PC |
| Price: | Negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 20000 pcs per month capacity |
| Delivery Time: | 10-14 days delivery time |
| Packaging Details: | Box |
| Place of Origin: | China |
| Certification: | High QC standard, 100% inspection |
| Key word: | Centerless Grinding Wheel |
| Feature: | High efficiency grinding |
| Common Shape: | 1A1 |
| Wheel Size: | Resin Maximum OD is 750mm Vitrified OD:300mm~500mm |
| Application: | Semiconductor and Photovoltaic industries |
| Grit size: | Resin bond the finest grit size is 3000 |
| Company Info. |
| Xinzheng Dia Abrasives Co.,Ltd |
| View Contact Details |
| Product List |
Centerless Grinding Wheels are made of grains of aluminum oxide and silicon carbide abrasive material, bonded together with vitrified, resin or rubber. Centerless Grinding Wheels are used on a wide variety of workpieces. They produce extremely close tolerances on metal cylindrical forms or parts.
Centreless grinding wheel is used for grinding cylindrical part out surface, supported without centres on a stationary work rest blade and moving between the grinding wheel and the regulating wheel.
Features:
Specification:
| Common Shape | Wheel Size | Grit Size | Classic Specification |
| 1A1 | Resin Maximum OD is 750mm Vitrified OD:300mm~500mm | Resin the finest grit size is 3000 |
Application
| Industry | Workpiece&Material | Machine | Bond | Working Data |
| Semiconductor and Photovoltaic industries | Ceramic, magnet, sapphire | Resin Vitrified |
For any inquire, quality feedback or technical question, there always be a professional responding answered by our technician team within 24 hours.
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