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| Categories | Thermal Pad Material | 
|---|---|
| Brand Name: | AOK | 
| Model Number: | TP800 | 
| Certification: | RoHS, Reach, UL | 
| Place of Origin: | China | 
| MOQ: | 1000 pcs | 
| Payment Terms: | T/T | 
| Delivery Time: | 13-15 working days | 
| Packaging Details: | 400 mm x 200 mm | 
| Product Name: | Low Thermal Resistance 8W/MK Pink Silicone Thermal Pad Material For Networking | 
| Composition: | Silicone | 
| Thermal conductivity: | 8.0±0.5 W/m.K | 
| Color: | Pink | 
| Hardness: | 55±10(Shore OO) | 
| Flammability: | V-0 | 
| Attribute | Value | Test Method | 
|---|---|---|
| Composition | Ceramic Filler + Silicone | - | 
| Color | Pink | Visual | 
| Thickness(mm) | 0.5~10 | astm d374 | 
| Density(g/cc) | 3.35 | ASTM D792 | 
| Hardness(shore oo) | 55±10 | ASTM D2240 | 
| Usage Temperature(℃) | -40~150 | -- | 
| Electrical | ||
| Breakdown Voltage(kv/mm) | >6.0 | ASTM D149 | 
| Dielectric Constant(@10mhz) | 7.2 | ASTM D150 | 
| Volume Resistivity(Ω.cm) | 1012 | ASTM D257 | 
| Flammability | V-0 | UL94 | 
| Thermal | ||
| Thermal conductivity(W/m.K) | 8.0±0.5 | ASTM D5470 | 
Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS
and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power
supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal
housing is used as heatsink.

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