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| Categories | HDI PCB |
|---|---|
| MOQ: | 1 |
| Price: | Contact Us |
| Payment Terms: | T/T |
| Supply Ability: | 200,000+ m² PCB per Month |
| Layer: | 16 layers |
| Material: | Fr4 |
| Thickness: | 3.0 mm |
| Construction: | 4+N+4 |
| Min. Line Width/Space: | 0.1/0.1mm |
| Surface Treatment: | Immersion Gold |
| Type: | Customizable |
| Application: | Electronic Product |
| Standard: | UL&IPC Standard &ISO |
| Company Info. |
| DQS Electronic Co., Limited |
| Verified Supplier |
| View Contact Details |
| Product List |
16 Layer Immersion Gold HDI PCB for Electronic Product
♦ What is Immersion Gold?
Immersion Gold (also known as ENIG – Electroless Nickel Immersion Gold) is a surface finish applied to printed circuit boards (PCBs) to protect exposed copper pads and ensure reliable solder connections. It consists of two layers:
♦ Key Characteristics of Immersion Gold (ENIG):
✔ Flat Surface – Ideal for fine-pitch components (e.g., BGAs,
QFNs).
✔ Excellent Solderability – Ensures strong, reliable solder
joints.
✔ Long Shelf Life – Resists oxidation better than bare copper
or OSP.
✔ Wire-Bondable – Suitable for gold or aluminum wire bonding
(used in IC packaging).
✔ Lead-Free & RoHS Compliant – Environmentally friendly
compared to HASL (lead-based).
♦ Comparison with Other PCB Finishes?
| Finish | Thickness | Flatness | Solderability | Cost | Best For |
|---|---|---|---|---|---|
| ENIG (Immersion Gold) | Thin Au (0.05–0.1µm) | Very Flat | Excellent | Moderate | High-reliability, fine-pitch |
| HASL (Hot Air Solder Leveling) | Thick Sn/Pb or Sn | Uneven | Good | Low | General-purpose PCBs |
| OSP (Organic Solderability Preservative) | Organic coating | Flat | Good (but degrades over time) | Low | Short-life consumer electronics |
| Electrolytic Hard Gold | Thick Au (0.5–1.5µm) | Flat | Good (but requires nickel underlayer) | High | Connectors, wear-resistant parts |
♦ Technical Parameters
Item | Spec |
Layers | 1~64 |
Board Thickness | 0.1mm-10 mm |
Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size | 800mm×1200mm |
Min Hole Size | 0.075mm |
Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance | 士0.10mm |
Insulation Layer Thickness | 0.075mm--5.00mm |
Out Layer Copper Thickness | 18um--350um |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 17um--175um |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 17:01 |
Solder Mask Type | LPI |
SMT Min. Solder Mask Width | 0.075mm |
Min. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
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