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Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

Categories HDI PCB
MOQ: 1
Price: Contact Us
Payment Terms: T/T
Supply Ability: 200,000+ m² PCB per Month
Layer: 16 layers
Material: Fr4
Thickness: 3.0 mm
Construction: 4+N+4
Min. Line Width/Space: 0.1/0.1mm
Surface Treatment: Immersion Gold
Type: Customizable
Application: Electronic Product
Standard: UL&IPC Standard &ISO
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Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product


16 Layer Immersion Gold HDI PCB for Electronic Product


♦ What is Immersion Gold?


​​Immersion Gold​​ (also known as ​​ENIG – Electroless Nickel Immersion Gold​​) is a ​​surface finish​​ applied to ​​printed circuit boards (PCBs)​​ to protect exposed copper pads and ensure reliable solder connections. It consists of two layers:

    1. ​​Electroless Nickel (Ni)​​ – A thin (3–6µm) nickel-phosphorus layer deposited chemically (without electricity) to act as a barrier, preventing copper diffusion.
    2. ​​Immersion Gold (Au)​​ – A very thin (0.05–0.1µm) gold layer plated over the nickel to prevent oxidation and enhance solderability.


♦ ​​Key Characteristics of Immersion Gold (ENIG):


✔ ​​Flat Surface​​ – Ideal for fine-pitch components (e.g., BGAs, QFNs).
✔ ​​Excellent Solderability​​ – Ensures strong, reliable solder joints.
✔ ​​Long Shelf Life​​ – Resists oxidation better than bare copper or OSP.
✔ ​​Wire-Bondable​​ – Suitable for gold or aluminum wire bonding (used in IC packaging).
✔ ​​Lead-Free & RoHS Compliant​​ – Environmentally friendly compared to HASL (lead-based).


♦ Comparison with Other PCB Finishes?​


FinishThicknessFlatnessSolderabilityCostBest For
​ENIG​​ (Immersion Gold)Thin Au (0.05–0.1µm)Very FlatExcellentModerateHigh-reliability, fine-pitch
​HASL​​ (Hot Air Solder Leveling)Thick Sn/Pb or SnUnevenGoodLowGeneral-purpose PCBs
​OSP​​ (Organic Solderability Preservative)Organic coatingFlatGood (but degrades over time)LowShort-life consumer electronics
​Electrolytic Hard Gold​Thick Au (0.5–1.5µm)FlatGood (but requires nickel underlayer)HighConnectors, wear-resistant parts

Technical Parameters


Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm


One-Stop PCBs Solution

PCB PrototypeFelx PCBRigid-Flex PCBCeramic PCB
Heavy Copper PCBHDI PCBHigh Frequency PCBHigh TG PCB

Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

Buy Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product at wholesale prices
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