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| Categories | HDI PCB | 
|---|---|
| MOQ: | 1 | 
| Price: | Contact Us | 
| Payment Terms: | T/T | 
| Supply Ability: | 200,000+ m² PCB per Month | 
| Layer: | 10 layers | 
| Material: | Fr4 | 
| Thickness: | 2.0 mm | 
| Construction: | 2+N+2 | 
| Min. Line Width/Space: | 0.1/0.1mm | 
| Surface Treatment: | Immersion Gold | 
| Type: | Customizable | 
| Application: | Electronic Product | 
| Standard: | UL&IPC Standard &ISO | 
| Company Info. | 
| DQS Electronic Co., Limited | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
12 Layer 3OZ High Density Interconnect HDI PCB
♦ What is High Density PCB (HDI PCB)?
A High Density Interconnect (HDI) PCB is an advanced printed circuit board designed to accommodate more components in a smaller space by using finer traces, smaller vias, and higher connection density than traditional PCBs. HDI technology enables miniaturization, improved signal integrity, and enhanced performance in modern electronics.
♦ Key Features of HDI PCBs:
✅ Finer Trace Width/Spacing (≤ 100µm, vs. standard 150µm+).
✅ Microvias (laser-drilled, < 150µm diameter) for high-density interconnects.
✅ Blind & Buried Vias (instead of through-hole vias) to save space.
✅ Thinner Dielectric Materials (for compact layer stacking).
✅ Higher Layer Count (often 8+ layers in a slim profile).
✅ Advanced Materials (low-loss dielectrics for high-speed signals).
♦ HDI PCB vs. Standard PCB: Key Differences?
| Feature | HDI PCB | Standard PCB | 
|---|---|---|
| Trace Width | ≤ 100µm (can go down to 40µm) | ≥ 150µm | 
| Via Size | Microvias (50–150µm) | Through-hole vias (≥ 300µm) | 
| Via Types | Blind, buried, stacked | Mostly through-hole | 
| Layer Count | 8+ (with thin dielectrics) | Typically 2–12 layers | 
| Signal Speed | Optimized for high-speed signals | Limited high-speed performance | 
| Applications | Smartphones, wearables, aerospace | Consumer electronics, power circuits | 
♦ Types of HDI PCBs:
♦ Technical Parameters
| Item | Spec | 
| Layers | 1~64 | 
| Board Thickness | 0.1mm-10 mm | 
| Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc | 
| Max Panel Size | 800mm×1200mm | 
| Min Hole Size | 0.075mm | 
| Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil | 
| Board Outline Tolerance | 士0.10mm | 
| Insulation Layer Thickness | 0.075mm--5.00mm | 
| Out Layer Copper Thickness | 18um--350um | 
| Drilling Hole (Mechanical) | 17um--175um | 
| Finish Hole (Mechanical) | 17um--175um | 
| Diameter Tolerance (Mechanical) | 0.05mm | 
| Registration (Mechanical) | 0.075mm | 
| Aspect Ratio | 17:01 | 
| Solder Mask Type | LPI | 
| SMT Min. Solder Mask Width | 0.075mm | 
| Min. Solder Mask Clearance | 0.05mm | 
| Plug Hole Diameter | 0.25mm--0.60mm | 
|   | 
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