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Superior Heat Dissipation Aluminum Alloy Coils Electronics Applications

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Qingdao Jero Steel Co., Ltd.
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Superior Heat Dissipation Aluminum Alloy Coils Electronics Applications

Superior Heat Dissipation Aluminum Alloy Coils for Electronics Applications
Product Specifications
TypeAluminum alloy coil
Thickness0.30-2.0mm
Alloy5052/6061/6013/7075
TemperH32/T6
Trade termsCIF, CNF, FOB, EXW
Aluminum is the gold standard for electronics housings, offering unmatched advantages in lightweight construction, thermal management, manufacturability, and cost-effectiveness.
Aluminum alloy coils for electronics applications
Our Manufacturing Capabilities
  • Standardized processes enhance efficiency, reduce errors, and boost productivity
  • Optimized work environment fosters positive attitudes and team cohesion
Advanced Production Facilities
All melting and holding furnaces supplied by GAUTSCHI (Switzerland)
1+1+4 and 1+5 hot rolling mills from SMS Group (Germany)
6 sets of cold rolling mills from SMS Group (Germany)
  • World-class equipment ensures consistent product quality
  • Specialized in high-quality aluminum alloy coils (1050, 1060, 1100, 3003, 3004, 3104, 5052, 6061)
  • Streamlined internal management for efficient production
Automatic Aluminum Coil Wrapping System
  • Reduced manual labor with faster, more consistent packaging
  • Precision control for uniform wrapping results
  • Secure packaging for safe transportation
Automated Three-dimensional Warehouse
  • Smart Storage: Automatically handles high-temperature coils with temperature monitoring
  • Automated Transport: Intelligent routing for coil transport based on production needs
  • Flexible Handling: Efficient delivery to next production stage
Secure Ocean Shipping
  • Cushioning materials and specialized lashing straps prevent movement
  • Non-slip wooden blocks under each coil for stability
  • Waterproof packaging with desiccants for moisture protection
Alloy Specifications and Applications
AlloyTemperTypical Use Cases
5052-H32H32Laptop bases, smart speakers
6061-T6T6Premium phone frames, server chassis
7075-T6T6Rugged/military devices
6013-T6T6Unibody metal designs
Key Advantages for Electronics Applications
Optimal Strength-to-Weight Ratio
  • Ultra-light (2.7g/cm³ density - 1/3 of stainless steel) with high strength
  • Enables 30%+ weight reduction in devices (e.g., 0.6mm thickness for laptop housings)
  • Military-grade alloys like 7075-T6 (560MPa) for ruggedized equipment
Superior Thermal Management
  • 237W/(m*K) thermal conductivity (200× better than plastics)
  • Lowers chip temperatures by 8-12°C (verified in unibody designs)
  • Compatible with advanced cooling solutions (vapor chamber welding)
EMI Shielding & Precision Manufacturing
  • >60dB EMI shielding (at 1GHz) for 5G/wireless devices
  • CNC machining precision: ±0.01mm tolerance (iPhone frame standard)
  • Anodized hardness >500HV (sapphire-level scratch resistance)
Standard Thickness Selection Guide
Product TypeThickness (mm)Application
Smartphones/Tablets0.4~0.8Slim design, CNC precision machining
Laptops0.6~1.2Structural support + thermal needs
Smart Watches/Earbuds0.3~0.6Ultra-lightweight, stamping
Servers/Routers1.0~2.0High strength + EMI shielding
Industry Application Examples
  • Apple MacBook: 6061-T6 CNC unibody (1.2mm thickness)
  • Huawei Mate Phones: 6013-T6 + nano-ceramic coating (0.6mm)
Product Tags:

Electronics Alloy Coils

  

Superior Heat Dissipation Alloy Coils

  
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Superior Heat Dissipation Aluminum Alloy Coils Electronics Applications

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