Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment

​​Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​

The diamond wire single/multi-wire high-speed high-precision descending/swinging cutting machine is a ​​composite processing equipment for hard and brittle materials​​. By combining ​​dynamic grinding of diamond wire​​ (steel wire coated with silicon carbide/aluminum oxide particles) and ​​multi-axis coordinated control​​, it achieves ​​high-precision cutting​​ of ultra-hard materials. Key design features include:

• ​​Multi-wire cutting​​: Utilizes multiple diamond wires simultaneously to enhance material utilization and efficiency.
• ​​High-speed motion​​: Wire speed up to 2400 m/min, significantly reducing processing time.
• ​​High-precision control​​: Servo/stepper motor-driven with ±0.01 mm cutting accuracy.
• ​​Swinging cutting​​: Worktable oscillates ±5°–±8° to optimize surface flatness.
• ​​Descending feed​​: Vertical movement of the workpiece or wire minimizes material stress damage.

This equipment is widely used in ​​semiconductors, photovoltaics, ceramics, gemstones, and medical fields​​, particularly for cutting ​​silicon carbide (SiC), sapphire, monocrystalline silicon, and quartz glass​​.

Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine technical specifications

Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine working principle

The machine operates on ​​"dynamic grinding of diamond wire + multi-axis synchronization"​​:

​​1. Diamond Wire Cycling​​:

• A high-speed rotating capstan drives diamond wire in ​​reciprocating or unidirectional motion​​.
• Tension wheels (pneumatic/spring-loaded) maintain wire tension (0.1–1.0 MPa), while guide wheels ensure stability.

2. ​​Material Feeding​​:

• ​​Descending feed​​: Workpiece platform moves vertically at 0.01–10 mm/min, or wire actively presses against the workpiece.
• ​​Swinging cutting​​: Worktable oscillates laterally (±15 mm amplitude) to prolong contact time and improve surface roughness.

​​3. Multi-wire Coordination​​:

• Multiple diamond wires are synchronized via a tensioning system for ​​continuous cutting of large-sized materials​​ (e.g., Φ300×300 mm workpieces).