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Customizable FR4 Material HDI Multilayer PCB with Thermal Resistance&Space Saving

Categories High Density PCB
Brand Name: High Density PCB
Place Of Origin: China
Model Number: As Per Customer's Model
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
MOQ: Sample,1 pc(5 square meters)
Price: Based on Gerber Files
Payment Terms: T/T,Western Union
Supply Ability: 100000㎡/Month
Delivery Time: NA
Packaging Details: As per Customer's Request
Product Type: HD/HDI Custom PCB
Min. Hole Size: 0.1mm
Min. Order Quantity: 1piece
Board Thickness: 0.2-5.0Mm
Pcba Standard: IPC Class 2
Layer Options: 1 to 30 Layers
Impedance Control: ±10% or +/-5%
SMT Technology: SMD, BGA, DIP, Etc.
Production Files: Gerber or Bom Files
Material: High Tg FR4/Rogers/Panasonic
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Customizable FR4 Material HDI Multilayer PCB with Thermal Resistance&Space Saving

Why choose this board?:

HDI technology enables next-generation electronics by breaking space constraints while boosting electrical performance. As devices evolve toward smaller form factors with higher functionality, HDI PCBs provide the essential foundation for innovation in 5G, AI, IoT, and portable medical systems.

Core Performance Advantages:

  • Miniaturization: 50-70% size/weight reduction vs. conventional PCBs.
  • Enhanced Signal Integrity: Shorter paths reduce inductance/crosstalk (critical for >5 GHz).
  • Improved Thermal Management: Dense thermal vias under BGAs.
  • Higher Reliability: Filled micro-vias resist thermal stress.
  • Design Flexibility: Supports complex ICs.

Structural Configurations:

TypeStructureTypical Applications
1-N-11 HDI layer sequenceWearables, Basic IoT
2-N-22 HDI layers per sideSmartphones, Tablets
Any-layerMicro-vias on all layersHigh-end CPUs, GPUs, 5G Modules
ELICEvery Layer InterconnectAerospace, Medical Implants


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