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Custom High Density PCB Board 4/6 Layers FR-4 Material Tailored for Mini Bluetooth Devices

Categories High Density PCB
Brand Name: xingqiang
Model Number: As Per Customer's Model
Certification: ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Place of Origin: China
MOQ: Sample,1 pc(5 square meters)
Price: Based on Gerber Files
Payment Terms: ,T/T,Western Union
Supply Ability: 100000㎡/Month
Delivery Time: NA
Packaging Details: As per Customer's Request
PCB Name: Custom High Density PCB Board
Material: FR4
Copper Overall: 0.5-5oz
Pcba Standard: IPC Class 2
Layers: 1-30 Layers
Minimum Line Space: 3mil (0.075mm)
Surface Finishing: HASL/OSP/ENIG
Other Services: ODM/OBM/PCBA
Quotation: Based on Gerber Files
Board Thinkness: 1.6mm/1.2mm/1.0mm/0.8mm or Customized
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Custom High Density PCB Board 4/6 Layers FR-4 Material Tailored for Mini Bluetooth Devices

Professional Custom HDI PCB ISO/IPC Certificated:

Professional custom high-density interconnect PCB engineered for Bluetooth headset control modules. Featuring 4/6-layer FR-4 base, BGA compatibility and ENIG plating, our tailor-made boards offer exceptional signal integrity, anti-interference and long-term reliability. ISO/IPC compliant, fully customizable specs to fit miniaturized wireless audio applications.



Why Choose Us:
✔ 30 Years’ Rigid-Flex & HDI PCB Expertise

✔ ISO 9001/RoHS/ISO/TS16949 Certified Quality

✔ Custom 4/6-Layer FR-4 HDI Boards | ENIG | BGA Ready

✔ DFM & Impedance Simulation Engineering Support

✔ Global Express Shipping (DHL/FedEx/UPS) to US, EU, JP & AU



Custom HDI Advantages:


CategoryKey Advantages
PerformanceStable RF signal, strong anti-interference, low signal loss
DesignHDI microvias, BGA compatible, compact size, high wiring density
QualityENIG finish, anti-oxidation, IPC/ISO certified, long-term reliability
Customization4/6-layer FR-4, flexible specs, low MOQ for prototyping
ServiceDFM/impedance support, fast turnaround, global express shipping
AssemblyExcellent solderability, ideal for SMT/BGA assembly
CostCost-effective mass production, reduced rework rate


Production Process:

1.Requirement Confirmation & Gerber Audit: Review customer Gerber files, BOM and technical inquiries; finalize all custom specifications including layer count, base material, ENIG surface finish, BGA layout, and HDI micro/blind/buried via requirements.
2. DFM Analysis & RF Impedance Simulation: Conduct professional Design for Manufacturability (DFM) check and impedance simulation.
3. Material Preparation & HDI Inner Layer Production: Prepare qualified FR‑4 raw materials and fabricate HDI inner layers with precise imaging, etching, and AOI inspection.
4. Multilayer Lamination & Outer Layer Processing: Perform layer lamination for 4/6-layer boards, followed by outer layer imaging, etching, and desmear processing.
5. ENIG Surface Treatment & Profile Milling: Apply ENIG (Electroless Nickel Immersion Gold) surface finish for better solderability and oxidation resistance; rout the board to custom outline and dimensions.
6. Electrical & Reliability Verification: Run electrical continuity/insulation test, impedance test, flying probe test, and reliability checks to meet IPC and customer quality standards.
7. Final Inspection, Packaging & Global Delivery: Complete final visual and dimensional inspection, conduct ESD‑safe packaging, and arrange global express shipment via DHL/FedEx/UPS.


Factory showcase


PCB Quality Testing



Certificates and Honors




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