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99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging

Categories Beryllium Copper Wire
Brand Name: WINNER
Model Number: BC001
Certification: ISO9100
Place of Origin: CHINA
MOQ: 1PC
Price: 999
Payment Terms: L/C, Western Union, T/T Supply Ability
Supply Ability: 100000 rolls per month
Delivery Time: 5-8 WORKING DAYS
Packaging Details: Roll, Neutrial Packing or with OEM LOGO
Purity: 99.999%
Bonding Method: Ultrasonic
Product Type: Bonding Wire
Diameter: 0.01-0.4mm
Length Meters: 500/1000
Thermal Conductivity: 318 W/mK
Application: Semiconductor Packaging
Package: Spool
Flexibility: High
Package Weight: 2.2 pounds
Electrical Conductivity: 45.5 MS/m
Tensile Strength: 100 ksi
Melting Point: 1064°C
Density: 8.96 g/cm3
Wire Diameter: 0.001 inches
Coating Thickness: 0.001mm
Material: Copper
Coating: Berullium
Corrosion Resistance: High
Temperature Range: -40°C to 200°C
Surface Finish: Bright
Conductivity: 98%
Package Size: 100 meters
Bond Strength: High
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99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging

Product Description

Our Ultra-fine Coated Beryllium Copper (BeCu) Wire is designed for applications requiring exceptional electrical conductivity, superior thermal performance, and high mechanical strength in a compact form factor.
With diameters as small as 0.015mm, this wire combines the strength of beryllium copper with the protective benefits of advanced surface coatings, ensuring long-term stability and resistance to oxidation, corrosion, and wear.

Produced under strict quality control in an ISO-certified facility, this wire is widely used in precision electronics, high-frequency connectors, aerospace, medical devices, and miniature spring contacts. Its excellent fatigue resistance and high resilience make it ideal for demanding environments where consistent performance is critical.


Key Features & Benefits

Ultra-fine Diameter Range: 0.015mm–0.2mm for micro-scale applications

Outstanding Electrical Conductivity: Copper-rich alloy ensures fast, stable signal transmission

Excellent Thermal Performance: Effective heat dissipation for high-load applications

High Mechanical Strength: Beryllium copper core provides superior durability and elasticity

Protective Coating: Enhances corrosion resistance and prolongs service life

Customizable Specifications: Diameter, coating material, and spool size tailored to your needs


Applications

High-frequency connectors and coaxial cables

Semiconductor test probes and contact springs

Precision electrical instruments and sensors

Aerospace and defense electronics

Medical device wiring and miniature actuators


Technical Specifications

Material: High-strength beryllium copper alloy with protective coating (Ni, Pd, Au, etc.)

Purity: Cu ≥ 99%

Diameter Range: 0.015mm–0.2mm (custom sizes available)

Tensile Strength: ≥ 1,000 MPa (varies by size)

Elongation: ≥ 2%

Surface Coating Thickness: As per customer requirements

Packaging: Cleanroom-grade spools, moisture-proof sealed packing




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