Thermal Conductivity Structural Two Part Urethane Adhesive Double Component Glue BZ-6800-100

BZ-6800-100: 1.2 W/m·K High Thermal Conductivity Polyurethane Structural Adhesive

BZ-6800-100 is a two-component, solvent-free polyurethane structural adhesive engineered for high-power electronic systems, offering exceptional thermal conductivity, mechanical strength, and flame retardancy. With a 1:1 volume mix ratio and paste-like consistency, it provides easy application and reliable bonding for battery modules, heat sinks, and electronic components. This adhesive complies with REACH and RoHS 2.0 standards, ensuring suitability for international markets and reducing environmental impact.

Key Product Features

1. 1.2 W/m·K Thermal Conductivity: Delivers efficient heat transfer from heat-generating components to heat sinks, preventing overheating and extending service life in power-dense systems like battery modules and electronic enclosures.
2. High Mechanical Strength: ≥6.0 MPa shear strength (aluminum/aluminum) and ≥5.0 MPa tensile strength ensure durable bonds in structural applications, even under mechanical stress and vibration.
3. UL94 V-0 Flame Retardancy: Achieves V-0 rating, providing critical fire safety for high-power electronic modules and energy storage systems.
4. Wide Substrate Compatibility: Bonds effectively to metals, fiber-reinforced composites, ceramics, and pretreated plastics, eliminating the need for surface treatments in most cases.
5. Low Volume Resistivity: ≥1.5×10¹³ Ω·cm ensures reliable electrical insulation, preventing short circuits and ensuring safe operation in electronic systems.

Technical Parameters

Product Applications

1. New Energy Battery Modules: Bonds battery cells to cooling plates and structural frames in electric vehicles and energy storage systems, ensuring efficient heat dissipation and mechanical stability.
2. Electronic Enclosure Assembly: Seals and bonds heat sinks to power modules in industrial electronics and telecommunications equipment, managing heat and preventing thermal runaway.
3. Aerospace & Defense Components: Assembles lightweight composite panels and heat exchangers in aircraft and defense systems, providing structural strength and thermal management in extreme environments.
4. Industrial Power Electronics: Bonds power modules and heat sinks in motor drives, inverters, and rectifiers, ensuring reliable performance in heavy machinery and automation equipment.
5. LED Lighting Systems: Mounts high-power LED chips to heat sinks, ensuring efficient heat dissipation and extending lifespan in stadium lighting, projection systems, and automotive headlights.

Critical Handling & Curing Precautions

1. Surface Preparation: Ensure surfaces are clean, dry, and free from oil, grease, or contaminants before application. For optimal bonding, lightly abrade metal surfaces to increase surface area.
2. Mixing & Application: Use a 1:1 volume ratio of A and B components, mixing thoroughly with a static mixer or mechanical stirrer. Apply immediately using a caulking gun or dispensing equipment, ensuring complete coverage of bonding surfaces.
3. Curing Conditions: Allow 7 days for full curing at 25°C, or accelerate curing at 80°C for ≥4 hours. Maintain workshop humidity below 70% during application to prevent moisture-induced defects.
4. Safety Precautions: Wear nitrile gloves and safety goggles during handling. If contact with eyes occurs, flush with plenty of water for at least 15 minutes and seek medical attention. Wash hands thoroughly with soap after use.

Directions for Use

1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc.
2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.

Packing & Shipping & Storage

1. Packaging: 400ml cartridges, 5-gallon drums, and 55-gallon drums for both Component A (light yellow paste) and Component B (gray-black paste).
2. Shelf Life: 6 months from production date when stored in a cool, dry place away from direct sunlight.
3. Opened Container: Seal tightly after use and store in a dry environment. Use within 3 days for optimal performance; discard if signs of contamination or curing are observed.