1 1 mix ratio thermally conductive encapsulant

Brand Name:Dowsil

Model Number:CN-6015

Place of Origin:USA

.... It offers curing flexibility with both room temperature and heat cure options, high thermal conductivity (1.6 W/m·K), low density, high flowability, and excellent flame retardancy (UL 94 V-0) for electronic components. Product Introduction This

Brand Name:Hanast

Model Number:HN-8820

... product specially designed for various electronic applications requiring excellent thermal conductivity and electrical insulation properties. This advanced potting compound is ideal for use in electric control units, providing reliable protection and

Brand Name:MC SILICONE

Model Number:MCSIL-E160

Place of Origin:China

...room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. Typical Use General potting applications: power supplies, connectors,

Brand Name:Aorun

Model Number:Aorun 1354

Place of Origin:China

...Encapsulation Quick Detail: Name Epoxy Resin 1354 Usage Epoxy floor coatings Mixing Ratio A: B =2:1 (By weight) Applications Epoxy floor coatings,Electronic component potting epoxy compound Description: silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength, thermal conductivity...