2 indium phosphide wafer

Brand Name:ZMSH

Model Number:Indium Phosphide Wafer

Place of Origin:China

Indium Phosphide Wafer InP Semiconductor Substrates Epitaxial 2'' 3'' Thickness 350um Description of Indium Phosphide: Indium Phosphide (InP) chips are a widely used material in optoelectronics and semiconductor devices. It has the following advantages: High electron mobility: Indium phosphide chips have a high electron mobility, which means that electrons move faster through the material. Controlled material properties: The properties of indium

Brand Name:PAM-XIAMEN

Place of Origin:China

...Indium Phosphide Wafer , 4”, Test Grade -InP Wafer Manufacturing PAM-XIAMEN provides single crystal InP(Indium phosphide) wafer for micro-electronic ( HBT/ HEMT ) and opto-electronic industry ( LED / DWDM / PIN / VCSELs ) in diameter up to 6 inch. Indium phosphide ( InP ) crystal is formed by two elements , Indium and Phosphide , growth by Liquid Encapsulated Czochralski ( LEC ) method or VGF method . InP wafer...

Brand Name:zmkj

Model Number:InP

Place of Origin:CHINA

.../3 inch/4 inch 350-650 um InP Crystal Wafer Dummy Prime Semiconductor Substrate Shanghai Xinkehui New Materials Co. Ltd. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in

Brand Name:ZG

Model Number:MS

Place of Origin:CHINA

...wafer ( Indium phosphide ) We provides high quality single crystal InP wafer ( Indium phosphide ) to micro-electronic ( HBT/ HEMT ) and opto-electronic industry ( LED / DWDM / PIN / VCSELs ) in diameter up to 3 inch . Indium phosphide ( InP ) crystal is formed by two elements , Indium and Phosphide , growth by Liquid Encapsulated Czochralski ( LEC ) method or VGF method . InP wafer...

Brand Name:HT

Model Number:HT-WSB

Place of Origin:China

Saw blade with diamond plated If you’re searching for the right dicing blades, we recommend our HT-RE electroformed bond blades. They are a high performance and high quality wafer saw manufactured using new electroforming technology. These blades are ...